APPLIED Materials says its new
Applied Producer Onyx film treatment system
can reduce power consumption in semiconductor chips.
The system optimises the molecular structure of the low k films that insulate the interconnects on each chip, allowing faster and more power-efficient logic devices to be fabricated as they scale to 22nm and below.
According to Applied Materials, the interconnect represents approximately one-third of the total power consumed by a chip. Targeting this makes sense in an approach to achieve higher performance and longer battery life in advanced logic devices.
With each successive technology node, interconnect wires get closer to one another, increasing the potential for parasitic capacitance, or crosstalk, between adjacent lines. This restricts switching speed and wastes power.
Reducing capacitance, by lowering the k-value of the insulating material that separates and supports these structures, is a key component in ensuring continued improvement in performance and battery life.
The company says the Onyx system drives carbon and silicon into the porous dielectric film to reinforce the insulating material at the atomic level.
It delivers the most power-efficient interconnects in the industry, while increasing mechanical strength, making the chip robust to better withstand the challenge of emerging 3D packaging applications.
New atomic-level treatment optimises chip interconnects Electronics News
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