Dow Corning and Suss cooperate on making 3-D TSV

Dow Corning and Suss cooperate on making 3-D TSV

MANHASSET, NY -- Dow Corning and SUSS MicroTec are collaborating on developing a material and equipment system solution for high volume manufacturing of 3-D TSV packaged devices.

Stacking two or more chips vertically using thru-silicon via technology is one of the viable ways to reduce the IC footprint, though it requires the industry to find a solution for handling thin wafers, using temporary bonding.

Comprised of both an adhesive and release layer, the Dow Corning silicon-based material is optimized for simple processing with a bi-layer spin coating and bonding process.

Combined with SUSS MicroTec equipment, the total solution offers the benefits of simple bonding using standard manufacturing methods, provides compatibility with thermal and chemical requirements for via middle and interposer TSV processing, as well as faster room temperature de-bonding required for advanced packaging applications.

Dow Corning (Midland, MI) builds on a long history of silicon-based innovation and collaboration in semiconductor packaging. Dow Corning is equally owned by The Dow Chemical Company and Corning, Inc, serving the diverse needs of more than 25,000 customers worldwide. SUSS MicroTec AG (Garching, Germany) is a supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets.
TAG:3 D TSVs Process Equipment