2011-12-08

North America's biggest dinosaur

In a paper published Dec. 6 in Acta Palaeontologica Polonica, MSU researcher Denver W. Fowler and coauthor Robert M. Sullivan from Harrisburg, Pa., describe two gigantic vertebrae and a femur that the team collected in New Mexico from 2003 to 2006. Carrying the vertebrae alone took most of a day and was a "killer" because the paleontologists carried them 1.2 miles through 100-degree heat, Fowler said.

The bones belong to the sauropod dinosaur Alamosaurus sanjuanensis: a long-necked plant eater related to Diplodocus. The Alamosaurus roamed what is now the southwestern United States and Mexico about 69 million years ago.

"Alamosaurus has been known for some time; its remains were first described in 1922 from the Naashoibito beds of New Mexico. Since then, more bones have been discovered in New Mexico, Utah, some really nice material from Texas, and Mexico, including a few partial skeletons," Fowler said.

The sheer size of the new bones caught the researchers by surprise, however.

"We used to think that a fully grown Alamosaurus measured around 60 feet long and weighed about 30 tons; but a 2009 study by another MSU researcher, Dr. Holly Woodward, found that a femur thought to belong to an adult was still growing," Fowler said. "This told us that Alamosaurus got even bigger, but we didn't imagine that it could get quite this big."

How big? The enormity of the new bones puts Alamosaurus in the same size league as other giant sauropods from South America, including Argentinosaurus which weighed about 70 tons, and is widely considered to be the biggest dinosaur of all.

"Over the past 20 years, Argentinean and Brazilian paleontologists have been unearthing bigger and bigger dinosaurs, putting the rest of the world in the shade," Fowler said. "However, our new finds not only show that Alamosaurus is newly recognized as the biggest dinosaur from North America, but also that it was right up there with the biggest South American species: the US is back in the fight for the No.1 spot."

Although comparison of the new Alamosaurus bones with the South American species gave the researchers an idea of size, giant specimens of sauropods like Alamosaurus and Argentinosaurus are only known from very fragmentary remains offering only a tantalizing glimpse of what a complete Alamosaurus might look like, Fowler said.

"We'd love to find more complete material," Fowler continued. "Fortunately, Alamosaurus bones are quite common in the Naashoibito of New Mexico, so we have a good chance of going back and finding more, but in order to dig up one of the world's biggest dinosaurs you need one of the world's biggest dinosaur digging teams and large digging equipment."

The Pennsylvania State Museum field crew is typically just two or three people, so there are limits on how many bones can be collected in one season, Fowler said. Even so, many new and important specimens have been recovered over the past 10 to 15 years, including new species, and other members of the fauna including the iconic carnivore Tyrannosaurus.

"We found a shed Tyrannosaurus tooth with another Alamosaurus neck bone that we were excavating," Fowler said. "The Tyrannosaurus may have lost its tooth while feeding on an Alamosaurus carcass."

The Alamosaurus discovery goes beyond just "size" bragging-rights, and may have important implications for other dinosaurs, Fowler said. Recent discoveries by paleontologist Jack Horner's paleo lab at the Museum of the Rockies have emphasized the importance of understanding growth and ontogeny in interpreting dinosaur evolution.

"Increasingly, we're finding that very large or small individuals often look very different, and are often described as different species," Fowler said. "Our findings show that Alamosaurus was originally described based on immature material, and this is a problem as characteristics that define a species are typically only fully gained at adult size. This means that we might be misinterpreting the relationships of Alamosaurus and possibly other sauropod dinosaurs too."

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North America's biggest dinosaur

RIM's PlayBook hacked, patched, hacked again

MOUNTAIN VIEW, Calif.--Last week, security researchers posted a video showing a successful BlackBerry PlayBook hack, exploiting a security hole in Research in Motion's enterprise level security encryption and granting users root access to the system.

RIM responded to the jailbreaking of its tablet by claiming it was just the PlayBook and not the firm's phones which had been compromised, promising to investigate the issue.

The BlackBerry PlayBook's operating system is based on software from QNX, which upcoming BlackBerry smartphones will also be running on.

The researchers, led by main hacker "Neuralic" decided to take the experiment a step further, releasing the jailbreak tool –known as Dingleberry-- to the public, via Twitter.

RIM quickly released an OTA update to fix the security breach, but within hours of the patch, Neuralic's hack squad had jailbroken it again, releasing an updated version of Dingleberry to the public for download.
On Wednesday (Dec. 7) morning, hacker Chris Wade posted that there had been 14581 downloads of the PlayBook jailbreak thus far.



RIM's PlayBook hacked, patched, hacked again

One of the world's smallest electronic circuits created

A team of scientists, led by Guillaume Gervais from McGill's Physics Department and Mike Lilly from Sandia National Laboratories, has engineered one of the world's smallest electronic circuits. It is formed by two wires separated by only about 150 atoms or 15 nanometers (nm). This discovery, published in the journal Nature Nanotechnology, could have a significant effect on the speed and power of the ever smaller integrated circuits of the future in everything from smartphones to desktop computers, televisions and GPS systems.

This is the first time that anyone has studied how the wires in an electronic circuit interact with one another when packed so tightly together. Surprisingly, the authors found that the effect of one wire on the other can be either positive or negative. This means that a current in one wire can produce a current in the other one that is either in the same or the opposite direction. This discovery, based on the principles of quantum physics, suggests a need to revise our understanding of how even the simplest electronic circuits behave at the nanoscale

In addition to the effect on the speed and efficiency of future electronic circuits, this discovery could also help to solve one of the major challenges facing future computer design. This is managing the ever-increasing amount of heat produced by integrated circuits. Well-known theorist Markus Büttiker speculates that it may be possible to harness the energy lost as heat in one wire by using other wires nearby. Moreover, Buttiker believes that these findings will have an impact on the future of both fundamental and applied research in nanoelectronics.

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One of the world's smallest electronic circuits created

New '3-D' transistors promising future chips, lighter laptops

The approach could enable engineers to build faster, more compact and efficient integrated circuits and lighter laptops that generate less heat than today's. The transistors contain tiny nanowires made not of silicon, like conventional transistors, but from a material called indium-gallium-arsenide.

The device was created using a so-called "top-down" method, which is akin to industrial processes to precisely etch and position components in transistors. Because the approach is compatible with conventional manufacturing processes, it is promising for adoption by industry, said Peide "Peter" Ye, a professor of electrical and computer engineering at Purdue.

A new generation of silicon computer chips, due to debut in 2012, will contain transistors having a vertical structure instead of a conventional flat design. However, because silicon has a limited "electron mobility" -- how fast electrons flow -- other materials will likely be needed soon to continue advancing transistors with this 3-D approach, Ye said.

Indium-gallium-arsenide is among several promising semiconductors being studied to replace silicon. Such semiconductors are called III-V materials because they combine elements from the third and fifth groups of the periodic table.

"Industry and academia are racing to develop transistors from the III-V materials," Ye said. "Here, we have made the world's first 3-D gate-all-around transistor on much higher-mobility material than silicon, the indium-gallium-arsenide."

Findings will be detailed in a paper to be presented during the International Electron Devices Meeting on Dec. 5-7 in Washington, D.C. The work is led by Purdue doctoral student Jiangjiang Gu; Harvard doctoral student Yiqun Liu; Roy Gordon, Harvard's Thomas D. Cabot Professor of Chemistry; and Ye.

Transistors contain critical components called gates, which enable the devices to switch on and off and to direct the flow of electrical current. In today's chips, the length of these gates is about 45 nanometers, or billionths of a meter. However, in 2012 industry will introduce silicon-based 3-D transistors having a gate length of 22 nanometers.

"Next year if you buy a computer it will have the 22-nanometer gate length and 3-D silicon transistors," Ye said.

The 3-D design is critical because the 22-nanometer gate lengths will not work in a flat design.

"Once you shrink gate lengths down to 22 nanometers on silicon you have to do more complicated structure design," Ye said. "The ideal gate is a necklike, gate-all-around structure so that the gate surrounds the transistor on all sides."

The nanowires are coated with a "dielectric," which acts as a gate. Engineers are working to develop transistors that use even smaller gate lengths, 14 nanometers, by 2015.

However, further size reductions beyond 14 nanometers and additional performance improvements are likely not possible using silicon, meaning new designs and materials will be needed to continue progress, Ye said.

"Nanowires made of III-V alloys will get us to the 10 nanometer range," he said.

The new findings confirmed that the device made using a III-V material has the potential to conduct electrons five times faster than silicon.

Creating smaller transistors also will require finding a new type of insulating layer essential for the devices to switch off. As gate lengths shrink smaller than 14 nanometers, the silicon dioxide insulator used in conventional transistors fails to perform properly and is said to "leak" electrical charge.

One potential solution to this leaking problem is to replace silicon dioxide with materials that have a higher insulating value, or "dielectric constant," such as hafnium dioxide or aluminum oxide.

In the new work, the researchers applied a dielectric coating made of aluminum oxide using a method called atomic layer deposition. Because atomic layer deposition is commonly used in industry, the new design may represent a practical solution to the coming limits of conventional silicon transistors.

Using atomic layer deposition might enable engineers to design transistors having thinner oxide and metal layers for the gates, possibly consuming far less electricity than silicon devices.

"A thinner dielectric layer means speed goes up and voltage requirements go down," Ye said.

The work is funded by the National Science Foundation and the Semiconductor Research Corp. and is based at the Birck Nanotechnology Center in Purdue's Discovery Park. The latest research is similar to, but fundamentally different from, research reported by Ye's group in 2009. That work involved a design called a finFET, for fin field-effect transistor, which uses a finlike structure instead of the conventional flat design. The new design uses nanowires instead of the fin design.

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New '3-D' transistors promising future chips, lighter laptops

Vampire star reveals its secrets

"We can now combine light from four VLT telescopes and create super-sharp images much more quickly than before," says Nicolas Blind (IPAG, Grenoble, France), who is the lead author on the paper presenting the results, "The images are so sharp that we can not only watch the stars orbiting around each other, but also measure the size of the larger of the two stars."

The astronomers observed* the unusual system SS Leporis in the constellation of Lepus (The Hare), which contains two stars that circle around each other in 260 days. The stars are separated by only a little more than the distance between the Sun and Earth, while the largest and coolest of the two stars extends to one quarter of this distance -- corresponding roughly to the orbit of Mercury. Because of this closeness, the hot companion has already cannibalised about half of the mass of the larger star.

"We knew that this double star was unusual, and that material was flowing from one star to the other," says co-author Henri Boffin, from ESO. "What we found, however, is that the way in which the mass transfer most likely took place is completely different from previous models of the process. The 'bite' of the vampire star is very gentle but highly effective."

The new observations are sharp enough to show that the giant star is smaller than previously thought, making it much more difficult to explain how the red giant lost matter to its companion. The astronomers now think that, rather than streaming from one star to the other, the matter must be expelled from the giant star as a stellar wind and captured by the hotter companion.

"These observations have demonstrated the new snapshot imaging capability of the Very Large Telescope Interferometer. They pave the way for many further fascinating studies of interacting double stars," concludes co-author Jean-Philippe Berger.

*The images were created from observations made with the Very Large Telescope Interferometer (VLTI) at ESOʼs Paranal Observatory using the four 1.8-metre Auxiliary Telescopes to feed light into a new instrument called PIONIER.

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Vampire star reveals its secrets

2011-12-07

IEDM: SuVolta transistor operates down to 0.4-V


LONDON – Startup SuVolta Inc. has announced that its novel transistor technology, dubbed PowerShrink, operates down to 0.425-V, approximately 300-mV below conventional processes. PowerShrink is based on a deeply depleted channel (DDC) transistor manufactured in epitixially grown doped silicon on the surface of a conventional bulk CMOS wafer.

The progress is set to be discussed in a paper due to be presented at the International Electron Device Meeting presented by a researcher from Fujitsu Semiconductor Ltd.

The paper entitled: Advanced channel engineering achieving aggressive reduction of VT variation for ultra-low-power applications, is co-authored by Fujitsu and SuVolta (Los Gatos, Calif.).

The reduction in variation is important because leakage current in transistors is exponentially dependent on VT and power dissipation is dominated by the low edge of the VT distribution. The tighter the distribution the lower the VT can be set.

Fujitsu has demonstrated low voltage operation of a 576-kbit SRAM block based on SuVolta's PowerShrink implemented in a 65-nm CMOS process technology. SuVolta is pitching PowerShrink as an alternative to both FinFETs and fully depleted SOI (FDSOI) which are generally considered to be the major strands of process technology beyond 22-nm. Intel has already introduced a FinFET process technology.

SuVolta's is hoping that publicly disclosed progress by Fujitsu will help persuade process research groups that its approach is superior to FinFET in that it more easily supports multiple threshold voltages over a wider voltage range, and lower cost than FDSOI in that it does not require premium-priced SOI wafers as its starting point.
Next: Engaged with foundries at 28-nm
IEDM: SuVolta transistor operates down to 0.4-V

Movidius raises $9 million from Celtic House, others


LONDON – Fabless mobile multimedia chip company Movidius Ltd. has raised $9 million in a Series C round of venture capital funding. The funds have come from all the existing shareholders. including Celtic House Venture Partners, Capital E, Emertec Gestion and AIB Seed Capital Fund.

Combined with previous investment rounds this brings the total investment raised to more than $30 million since the company was founded in 2005.

Movidius (Dublin, Ireland) said it would use the money to develop "revenue growth" as it continues deployments of its Myriad platform to customers in the mobile phone and consumer electronics markets.

When Movidius started out it pitched itself as a company that would allow editing of user-generated content on smart phones. The Myriad 3-D platform combines a multicore multimedia processor with application software that the company sees being used for autostereoscopic 3-D multimedia capabilities including real-time 2-D to 3-D conversion of video, high-definition 3-D video capture and HD 3-D display.

Sean Mitchell, CEO Movidius commented, "Our funding announcement comes as we end a year of tremendous growth which saw Movidius continue to engage with the top players in the mobile handset space."

Movidius said it will demonstrate Myriad technology at the Consumer Electronics Show in Las Vegas in January and at Mobile World Congress in Barcelona in February.


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www.movidius.com

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Mobile video processor startup raises $7.5 million


Movidius extends Myriad processor to Android

Mobile video processor goes 3-D



Movidius raises $9 million from Celtic House, others

GainSpan raises $18 million from Intel Capital, others


LONDON – GainSpan Corp., a developer of embedded Wi-Fi chips and modules, has raised $18 million in a Series C round of funding. Hatteras Funds, based in New York and North Carolina, and Mobile Internet Capital, based in Japan, joined in the round along with existing investors Opus Capital, In-Q-Tel, Intel Capital, New Venture Partners, Sigma Partners and Camp Ventures.

GainSpan (San Jose, Calif.) said it would use the money to develop its next Wi-Fi chip. And the Series C round brings the amount of money raised by GainSpan to more than $56 million since its formation in 2006 as spin-off from Intel Corp.

In-Q-Tel is the investment arm of the Cental Intelligence Agency.

GainSpan said it has experienced "significant" quarter-to-quarter growth in sales and design wins during 2011, partly as a result of Wi-Fi being accepted increasingly as the technology of choice for the Internet of Things. The company did not quantify the progress.

"GainSpan is clearly poised to capitalize on what has become a massive move to connect things to the Internet," said Hideaki Yajima, executive director of Mobile Internet Capital Inc., in a statement issued by GainSpan.

Matt Lesesky of Hatteras Funds said: "We think the company has the potential to help transform the practice of medicine by enabling remote health and wellness services on a wide scale."

GainSpan entered the Silicon 60, EE Times' list of emerging startup companies at version 7.0 in February 2008. The latest edition of the Silicon 60 is version 12.5, which is the subject of a detailed technology and employment digital edition which can be accessed via http://e.ubmelectronics.com/Silicon60/index.html


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www.gainspan.com

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Intel invests in embedded Wi-Fi firm

ZeroG chief executive joins GainSpan

CIA expands investments in semiconductors



GainSpan raises $18 million from Intel Capital, others

Foundry to offer FRAM as standard offering

SAN FRANCISCO—Chip foundry Silterra Malaysia Sdn Bhd and chip and materials vendor Symetrix Corp. will collaborate to offer non-volatile ferroelectric random access memory (FRAM) as a standard memory offering for the first time under the terms of an agreement announced Wednesday (Dec. 7).

FRAM, also known as FeRAM, is a niche non-volatile memory type used in applications such as smart cards, smart meters and automotive controllers. FRAM devices write faster than flash but are more expensive to produce and thus currently make up a small percentage of the overall memory chip market.

Silterra (Kulim, Malaysia) and Symterix (Colorado Springs, Colo.) said making FRAM a standard offering at Silterra will enable the design community to incorporate the features of the technology into their designs. According to the companies, FRAM technology writes data fast, often and at very low power that is typically greater than 1,000 times better than embedded flash memory. 

The companies claim the collaboration marks the first time that FRAM technology will be made available by a foundry as a standard offering. FRAM vendor Ramtron International Corp. offers FRAM devices built by IBM Corp. under a foundry agreement.

Symetrix will supply the process technology and will work jointly with Silterra to qualify the FRAM process on SilTerra's CL180LP low power logic process, the companies said.  Because the incorporation of FRAM does not alter the underlying CMOS characteristics, all of the standard design libraries for this process will be available, they said. A library of silicon-proven FRAM memory macros will also be developed for use by Silterra customers, the companies said.

Foundry to offer FRAM as standard offering

Measuring living cells' mechanical properties: Technology could diagnose human disease, shed light on biological processes

The team used an instrument called an atomic force microscope to study three distinctly different types of cells to demonstrate the method's potentially broad applications, said Arvind Raman, a Purdue University professor of mechanical engineering.

For example, the technique could be used to study how cells adhere to tissues, which is critical for many disease and biological processes; how cells move and change shape; how cancer cells evolve during metastasis; and how cells react to mechanical stimuli needed to stimulate production of vital proteins. The technique could be used to study the mechanical properties of cells under the influence of antibiotics and drugs that suppress cancer to learn more about the mechanisms involved.

Findings have been posted online in the journal Nature Nanotechnology and will appear in the December print issue. The work involves researchers from Purdue and the University of Oxford.

"There's been a growing realization of the role of mechanics in cell biology and indeed a lot of effort in building models to explain how cells feel, respond and communicate mechanically both in health and disease," said Sonia Contera, a paper co-author and director of the Oxford Martin Programme on Nanotechnology and an academic fellow at Oxford physics. "With this paper, we provide a tool to start addressing some of these questions quantitatively: This is a big step."

An atomic force microscope uses a tiny vibrating probe to yield information about materials and surfaces on the scale of nanometers, or billionths of a meter. Because the instrument enables scientists to "see" objects far smaller than possible using light microscopes, it could be ideal for "mapping" the mechanical properties of the tiniest cellular structures.

"The maps identify the mechanical properties of different parts of a cell, whether they are soft or rigid or squishy," said Raman, who is working with doctoral student Alexander Cartagena and other researchers. "The key point is that now we can do it at high resolution and higher speed than conventional techniques."

The high-speed capability makes it possible to watch living cells and observe biological processes in real time. Such a technique offers the hope of developing a "mechanobiology-based" assay to complement standard biochemical assays.

"The atomic force microscope is the only tool that allows you to map the mechanical properties -- take a photograph, if you will -- of the mechanical properties of a live cell," Raman said.

However, existing techniques for mapping these properties using the atomic force microscope are either too slow or don't have high enough resolution.

"This innovation overcomes those limitations, mostly through improvements in signal processing," Raman said. "You don't need new equipment, so it's an economical way to bump up pixels per minute and get quantitative information. Most importantly, we applied the technique to three very different kinds of cells: bacteria, human red blood cells and rat fibroblasts. This demonstrates its potential broad utility in medicine and research."

The technique is nearly five times faster than standard atomic force microscope techniques.

The Nature Nanotechnology paper was written by Raman; Cartagena; Sonia Trigueros, a Senior Research Fellow in the Oxford Martin Programme on Nanotechnology; Oxford doctoral student Amadeus Stevenson; Purdue instructor Monica Susilo; Eric Nauman, an associate professor of mechanical engineering; and Contera.

The National Science Foundation and Engineering and Physical Sciences Research Council of the U.K. funded the research.

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Measuring living cells' mechanical properties: Technology could diagnose human disease, shed light on biological processes

Oxidative stress: Less harmful than suspected?

Arterial calcification and coronary heart disease, neurodegenerative diseases such as Parkinson's and Alzheimer's, cancer and even the aging process itself are suspected to be partially caused or accelerated by oxidative stress. Oxidative stress arises in tissues when there is an excess of what are called reactive oxygen species (ROS). "However, up to now, nobody was able to directly observe oxidative changes in a living organism and certainly not how they are connected with disease processes," said Associate Professor (PD) Dr. Tobias Dick of DKFZ. "There were only fairly unspecific or indirect methods of detecting which oxidative processes are really taking place in an organism."

For the first time, Tobias Dick and his co-workers have been able to observe these processes in a living animal. Jointly with Dr. Aurelio Teleman (also of DKFZ), they introduced genes for biosensors into the genetic material of fruit flies. These biosensors are specific for various oxidants and indicate the oxidative status of each cell by emitting a light signal -- in realtime, in the whole organism and across the entire life span.

In the fly larvae, the investigators already discovered that oxidants are produced at very differing levels in different tissue types. Thus, blood cells produce considerably more oxidants in their energy plants, the mitochondria, than, for example, intestinal or muscle cells. In addition, the larvae's behavior is reflected in the production of oxidants in individual tissues: The researchers were able to distinguish whether the larvae were eating or moving by the oxidative status of the fat tissue.

Up to now, many scientists have assumed that the aging process is associated with a general increase in oxidants throughout the body. However, this was not confirmed by the observations made by the investigators across the entire life span of the adult animals. They were surprised that almost the only age-dependent increase in oxidants was found in the fly's intestine. Moreover, when comparing flies with different life spans, they found out that the accumulation of oxidants in intestinal tissue even accelerated with a longer life span. The group thus found no evidence supporting the frequently voiced assumption that an organism's life span is limited by the production of harmful oxidants.

Even though comprehensive studies have failed to provide proof until the present day, antioxidants are often advertised as a protection against oxidative stress and, thus, health-promoting. Dick and colleagues fed their flies with N-acetyl cysteine (NAC), a substance which is attributed an antioxidant effect and which some scientists consider suitable for protecting the body against presumably dangerous oxidants. Interestingly, no evidence of a decrease in oxidants was found in the NAC-fed flies. On the contrary, the researchers were surprised to find that NAC prompted the energy plants of various tissues to significantly increase oxidant production.

"Many things we observed in the flies with the help of the biosensors came as a surprise to us. It seems that many findings obtained in isolated cells cannot simply be transferred to the situation in a living organism," said Tobias Dick, summarizing their findings. "The example of NAC also shows that we are currently not able to predictably influence oxidative processes in a living organism by pharmacology," he adds. "Of course, we cannot simply transfer these findings from fly to man. Our next goal is to use the biosensors to observe oxidative processes in mammals, especially in inflammatory reactions and in the development of tumors."

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Oxidative stress: Less harmful than suspected?

New interactivity with Samsung’s optical sensor in pixel panels Electronics News

SAMSUNG has started mass production of “optical sensor in pixel” LCD panels, which integrates infrared sensors to detect reflected images of an object on the panel.

The new panel, which is being manufactured in the 40 inch form factor, will be able to more accurately assess touch sensitivity.

The technology can detect more than 50 touch points simultaneously. This means the screen can function as a keyboard, mouse and scanner, in addition to providing full HD resolution display and wide angle viewing.

Product-wise, the new type of LCD panel will see first usage in the Samsung SUR40 for Microsoft Surface, which is a touch table product.


New interactivity with Samsung's optical sensor in pixel panels Electronics News

Australia-Europe collaboration develops senior mobility monitoring device Electronics News

ROYAL Philips Electronics is collaborating with Neuroscience Research Australia (NeuRA) to develop technologies which predict and prevent falls in older adults.

The iStoppFalls project is an European venture aiming to prevent falls in the home, especially for senior citizens.

The companies will develop and test a senior mobility monitoring device that will unobtrusively assess the balance and mobility of participants.

Philips has its own fall detection technology with the Lifeline and AutoAlert pendant-type help button, but says the new project aims to reduce falls, in addition to detecting falls.

Harry van Dyk, Country Manager for Philips Electronics Australia hopes this collaboration will ignite the use of technology to support independent living in Australia.

“Philips is invested in developing products and solutions that will enable active independent living in the home.  In Australia, we are focused on both testing and developing fall detection and prevention solutions, as well as introducing other assistive technologies such as medication dispensing devices.”

Among seniors, falls are the leading cause of nonfatal injuries and hospital admissions for trauma, as well as injury-related deaths.

Close to 50 percent of seniors can’t get up from a fall without help and lying on the floor for an extended period of time can lead to serious complications, including: pressure ulcers, muscle necrosis, dehydration, hypothermia and pneumonia.

According to the companies, modern ICT technologies like sensors, telemedicine and home entertainment can help older people be more independent within their own homes.

The iStoppFalls project will also develop an exercise-based videogame to deliver fall prevention training into the homes of older adults. These videogames could also increase overall levels of physical activity in older adults.

The research project will be funded by the European Commission under the 7th Framework Programme (FP7) and the Australian Government.


Australia-Europe collaboration develops senior mobility monitoring device Electronics News

Solar storms could sandblast the moon

The research is being led by Rosemary Killen at NASA's Goddard Space Flight Center, Greenbelt, Md., as part of the Dynamic Response of the Environment At the Moon (DREAM) team within the NASA Lunar Science Institute.

CMEs are basically an intense gust of the normal solar wind, a diffuse stream of electrically conductive gas called plasma that's blown outward from the surface of the Sun into space. A strong CME may contain around a billion tons of plasma moving at up to a million miles per hour in a cloud many times the size of Earth.

The moon has just the barest wisp of an atmosphere, technically called an exosphere because it is so tenuous, which leaves it vulnerable to CME effects. The plasma from CMEs impacts the lunar surface, and atoms from the surface are ejected in a process called "sputtering."

"We found that when this massive cloud of plasma strikes the moon, it acts like a sandblaster and easily removes volatile material from the surface," said William Farrell, DREAM team lead at NASA Goddard. "The model predicts 100 to 200 tons of lunar material -- the equivalent of 10 dump truck loads -- could be stripped off the lunar surface during the typical 2-day passage of a CME."

This is the first time researchers have attempted to predict the effects of a CME on the moon. "Connecting various models together to mimic conditions during solar storms is a major goal of the DREAM project," says Farrell.

Plasma is created when energetic events, like intense heat or radiation, remove electrons from the atoms in a gas, turning the atoms into electrically charged particles called ions. The Sun is so hot that the gas is emitted in the form of free ions and electrons called the solar wind plasma. Ejection of atoms from a surface or an atmosphere by plasma ions is called sputtering.

"Sputtering is among the top five processes that create the moon's exosphere under normal solar conditions, but our model predicts that during a CME, it becomes the dominant method by far, with up to 50 times the yield of the other methods," says Killen, lead author of a paper on this research appearing in a special issue of the Journal of Geophysical Research Planets.

CMEs are effective at removing lunar material not only because they are denser and faster than the normal solar wind, but also because they are enriched in highly charged, heavy ions, according to the team. The typical solar wind is dominated by lightweight hydrogen ions (protons). However, a heavier helium ion with more electrons removed, and hence a greater electric charge, can sputter tens of times more atoms from the lunar surface than a hydrogen ion.

The team used data from satellite observations that revealed this enrichment as input to their model. For example, helium ions comprise about four percent of the normal solar wind, but observations reveal that during a CME, they can increase to over 20 percent. When this enrichment is combined with the increased density and velocity of a CME, the highly charged, heavy ions in CMEs can sputter 50 times more material than protons in the normal solar wind.

"The computer models isolate the contributions from sputtering and other processes," says Dana Hurley, a co-author on the paper at the Johns Hopkins University Applied Physics Laboratory in Laurel, Md. "Comparing model predictions through a range of solar wind conditions allows us to predict the conditions when sputtering should dominate over the other processes. Those predictions can later be compared to data during a solar storm."

The researchers believe that NASA's Lunar Atmosphere And Dust Environment Explorer (LADEE) -- a lunar orbiter mission scheduled to launch in 2013 -- will be able to test their predictions. The strong sputtering effect should kick lunar surface atoms to LADEE's orbital altitude, around 20 to 50 kilometers (about 12.4 to 31 miles), so the spacecraft will see them increase in abundance.

"This huge CME sputtering effect will make LADEE almost like a surface mineralogy explorer, not because LADEE is on the surface, but because during solar storms surface atoms are blasted up to LADEE," said Farrell.

The moon is not the only heavenly body affected by the dense CME driver gas. Space scientists have long been aware that these solar storms dramatically affect Earth's magnetic field and are responsible for intense aurora (Northern and Southern Lights).

While certain areas of the Martian surface are magnetized, Mars does not have a magnetic field that surrounds the entire planet. Therefore, CME gases have a direct path to sputter and erode that planet's upper atmosphere. In late 2013, NASA will launch the Mars Atmosphere and Volatile Evolution (MAVEN) mission that will orbit the Red Planet to investigate exactly how solar activity, including CMEs, removes the atmosphere.

On exposed small bodies like asteroids, the dense, fast-streaming CME gas should create a sputtered-enhanced exosphere about the object, similar to that expected at the Moon.

Papers on different aspects of the CME impact simulation are being written and will appear in the special issue of the Journal of Geophysical Research Planets. The team's research will also be presented December 5 during the fall meeting of the American Geophysical Union in San Francisco.

For more information about the DREAM team visit: http://ssed.gsfc.nasa.gov/dream/

NLSI is a virtual organization that enables collaborative, interdisciplinary research in support of NASA lunar science programs. The institute uses technology to bring scientists together from around the world and is composed of competitively selected U.S. teams and several international partners. NASA's Science Mission Directorate and the Human Exploration and Operations Mission Directorate in Washington fund NLSI, which is managed by NASA's Ames Research Center at Moffett Field, Calif.

For more information about the NLSI, visit: http://lunarscience.nasa.gov/

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Solar storms could sandblast the moon

Designing LEDs for the Louvre: aesthetics and cultural considerations Electronics News

THE LOUVRE Museum in Paris is now lit by Toshiba’s LED products, following a lighting ceremony on 6 December.

Louvre Director Henri Loyrette and Toshiba's President Norio Sasaki illuminated the Pyramid, the Pyramidion and Pavilion Colbert during the ceremony after a count-down.

According to Toshiba, designing the solutions to light the Louvre subject the team to a number of “culture shocks” in terms of the engineering process involved with the project.

In the first instance, the goal was not to change to a more innovative style of lighting, but rather to preserve the look of the Louvre. Where the Japanese engineering ethos tended to focus on technology, the French emphasised the purpose of the technology.

For example, the project had to be approved by both the Louvre Technical Directorate, as well as Museum Director Henri Loyrette and the Historical Monuments Committee for approval.

In the second, post-technical stage of approvals, Toshiba had to consider the configuration of the fixtures for suitably illuminating the museum, the aesthetics of the light as it fits into Parisian scenery, as well as the exterior colour and shapes of the fixtures themselves.

Toshiba had to harmonise the fixtures with the building as part of the scenery, and revised the design into a shape that made the most of contours.

The company also made the fixtures more compact, used long-life LED technology, and to save energy, installed the LED light-emitting section and the power circuit on the same board.

There was also discussion regarding the colour temperature of the LEDs. Toshiba proposed a “light bulb colour” at 2700K but the initial French preference was for a warmer colour tone. During a demonstration at the site comparing the colours, the Louvre Director and the Paris Historical Monuments Committee approved of the “light bulb colour” temperature.

To further comply with aesthetic requirements around the Louvre, the Toshiba team narrowed the scope of light to approximately 30° coverage, and installed diffusion filters in front of the diodes to eliminate the sense of the dotted effect that comes from using multiple LEDs in a light source.

Toshiba constructed numerous prototypes during the development process, and experimented with these to match the needs of the Louvre and the Historical Monuments Committee.

The LEDs have very low light intensity attenuation over the years, and consume around one quarter the power of Xenon tubes.

The lights that illuminate the Pyramid have also been converted to LED. They have been designed to a specification that meets the IP65 rating for dust and water protection.


Designing LEDs for the Louvre: aesthetics and cultural considerations Electronics News

First molybdenite chip for improved miniaturisation, flexible electronics Electronics News

École Polytechnique Fédérale de Lausanne (EPFL) researchers have made the world’s first molybdenite chip showing it can surpass the physical limits of silicon.

According to the scientists, molybdenite is better suited to improved miniaturisation, electricity consumption, and mechanical flexibility compared to conventional silicon.

The researchers built an initial prototype, putting from two to six serial transistors in place. This showed the possibility of basic binary logic operations on a molybdenite chip, and opened the way to a larger chip.

This development follows work in early 2011 where the same lab unveiled the electronics potential of molybdenum disulfide (MoS2), a relatively abundant, naturally occurring mineral.

Molybdenum disulfide has semiconducting properties and a structure that make it an ideal material for use in transistors. It competes directly with silicon but also rivals up-and-coming semiconductor poster child graphene.

The main advantage of MoS2 is that it allows further miniaturisation of transistors.

It has not been possible up to this point to make layers of silicon less than two nanometers thick, because of the risk of initiating a chemical reaction that would oxidise the surface and compromise its electronic properties.

Molybdenite can be worked in layers only three atoms thick, making it possible to build chips that are at least three times smaller. At this scale, the material is still very stable and conduction is easy to control.

MoS2 transistors can be turned on and off much more quickly, and also put into a more complete standby mode.

Molybdenite is on a par with silicon in terms of its ability to amplify electronic signals, with an output signal that is four times stronger than the incoming signal.

Molybdenite also has mechanical properties that make it interesting as a possible material for use in flexible electronics, such as eventually in the design of flexible sheets of chips.


First molybdenite chip for improved miniaturisation, flexible electronics Electronics News

Apple loses iPad trademark battle in China Electronics News

APPLE has lost a trademark battle for its iPad tablet device in china, with the Shenzen patent court ruling in favour of Chinese company Proview Technology.

Proview Technology trademarked the name iPad in China in 2000. In 2006, Apple bought a “global trademark” on the iPad from IP Application Development.

However, Proview Technology sued Apple for trademark infringement in October due to the sale and advertisement of the iPad device in China.

Given the loss of the case, Apple has a number of avenues open for it. It will probably appeal the decision to a higher court, settle the lawsuit with Proview for an amount of money, or rename the iPad in China.


Apple loses iPad trademark battle in China Electronics News

NASA's Voyager hits new region at solar system edge

"Voyager tells us now that we're in a stagnation region in the outermost layer of the bubble around our solar system," said Ed Stone, Voyager project scientist at the California Institute of Technology in Pasadena. "Voyager is showing that what is outside is pushing back. We shouldn't have long to wait to find out what the space between stars is really like."

Although Voyager 1 is about 11 billion miles (18 billion kilometers) from the sun, it is not yet in interstellar space. In the latest data, the direction of the magnetic field lines has not changed, indicating Voyager is still within the heliosphere, the bubble of charged particles the sun blows around itself. The data do not reveal exactly when Voyager 1 will make it past the edge of the solar atmosphere into interstellar space, but suggest it will be in a few months to a few years.

The latest findings, described Dec. 5 at the American Geophysical Union's fall meeting in San Francisco, come from Voyager's Low Energy Charged Particle instrument, Cosmic Ray Subsystem and Magnetometer.

Scientists previously reported the outward speed of the solar wind had diminished to zero in April 2010, marking the start of the new region. Mission managers rolled the spacecraft several times this spring and summer to help scientists discern whether the solar wind was blowing strongly in another direction. It was not. Voyager 1 is plying the celestial seas in a region similar to Earth's doldrums, where there is very little wind.

During this past year, Voyager's magnetometer also detected a doubling in the intensity of the magnetic field in the stagnation region. Like cars piling up at a clogged freeway off-ramp, the increased intensity of the magnetic field shows that inward pressure from interstellar space is compacting it.

Voyager has been measuring energetic particles that originate from inside and outside our solar system. Until mid-2010, the intensity of particles originating from inside our solar system had been holding steady. But during the past year, the intensity of these energetic particles has been declining, as though they are leaking out into interstellar space. The particles are now half as abundant as they were during the previous five years.

At the same time, Voyager has detected a 100-fold increase in the intensity of high-energy electrons from elsewhere in the galaxy diffusing into our solar system from outside, which is another indication of the approaching boundary.

"We've been using the flow of energetic charged particles at Voyager 1 as a kind of wind sock to estimate the solar wind velocity," said Rob Decker, a Voyager Low-Energy Charged Particle Instrument co-investigator at the Johns Hopkins University Applied Physics Laboratory in Laurel, Md. "We've found that the wind speeds are low in this region and gust erratically. For the first time, the wind even blows back at us. We are evidently traveling in completely new territory. Scientists had suggested previously that there might be a stagnation layer, but we weren't sure it existed until now."

Launched in 1977, Voyager 1 and 2 are in good health. Voyager 2 is 9 billion miles (15 billion kilometers) away from the sun.

The Voyager spacecraft were built by NASA's Jet Propulsion Laboratory in Pasadena, Calif., which continues to operate both. JPL is a division of the California Institute of Technology. The Voyager missions are a part of the NASA Heliophysics System Observatory, sponsored by the Heliophysics Division of the Science Mission Directorate in Washington. For more information about the Voyager spacecraft, visit: http://www.nasa.gov/voyager .

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NASA's Voyager hits new region at solar system edge

Former Intersil exec takes helm at Exar

SAN FRANCISCO—Chip and subsystem vendor Exar Corp. Tuesday (Dec. 6) named Louis DiNardo, a 30-year semiconductor industry veteran and former Intersil president and chief operating officer, to the position of president and CEO.

Exar (Fremont, Calif.) said DiNardo replaces Richard Leza, who acted as president and CEO on an interim basis. Leza, Exar's chairman, ran the company on an interim basis since early last month, when then President and CEO Pete Rodriquez resigned.

DiNardo will become a member of the Exar's board beginning Jan. 3, 2012, Exar said.

"Lou brings to our organization executive leadership and demonstrated experience across a wide range of disciplines," Leza said, in a statement.

DiNardo was most recently a partner at San Francisco-based venture capital firm Crosslink Capital. Earlier in his career he was president and COO at Intersil from 2004 to 2006 and president and CEO of Xicor Inc., a chip company that was acquired by Intersil in 2004. Prior to Xicor, DiNardo spent 13 years at Linear Technology Corp., where he served as vice president of worldwide marketing and general manager of the mixed-signal business unit. He began his career at Analog Devices Inc.

DiNardo also serves on the board of directors of a number of firms, including Sysnapsense Corp. and SoloPower Inc.

In connection with his appointment, DiNardo was granted an option to purchase 1.2 million shares of Exar's common stock, the company said.

Former Intersil exec takes helm at Exar

Report: McAfee cuts jobs

SAN FRANCISCO—Security software maker McAfee, a subsidiary of chip giant Intel Corp., cut about 250 jobs, or roughly 3 percent of its workforce, according to a report by the Reuters news service.

According to the report, which quoted a McAfee spokesman, the job cuts were part of a bid by McAfee to focus on core businesses and improve efficiency to compete with market leader Symantec.

Earlier this week, McAfee promoted Stuart McClure to the position of chief technology officer.

Intel finalized the $7.68 billion acquisition of McAfee in February.

Report: McAfee cuts jobs

Broadcom slips into top 5 in smartphone CPUs

SAN FRANCISCO—Broadcom Corp. slipped into the top five in sales of smartphone applications processors in the third quarter for the first time, surpassing Nvidia Corp., according to market research firm Strategy Analytics Inc.

Stuart Robinson, director of the Strategy Analytics handset component technologies service, credited the ramp of Broadcom's Android business for the firm's rise to the No. 5 spot in smartphone processors. "We continue to believe that Broadcom has the potential to be a strong competitor to Qualcomm in the long-term, given the company's integration capabilities, cellular IP strength and strong emphasis on wireless markets," Robinson said.

Overall, the global smartphone applications processor market registered sales of $2.24 billion in the third quarter, a 59 percent increase from the third quarter of 2010, according to the latest report from Strategy Analytics (Boston) said.

Qualcomm Inc. again led the smartphone applications processor market in both unit shipment and revenue terms in the third quarter, accounting for 49 percent of revenue, Strategy Analytics said. Samsung Electronics Co., Texas Instruments Inc. and Marvell Technology Group Ltd. made up the rest of the top five in the quarter, the firm said.

According to the Strategy Analytics report, standalone applications processors outgrew baseband-integrated applications processors in the third quarter, accounting for 41 percent of total smartphone applications processor shipments, up from 31 percent in the third quarter of 2010. Strategy Analytics attributed this growth to strong demand for dual-core processors and growth in LTE smartphone shipments.

Qualcomm, a strong advocate of baseband-integrated processors, now also participates in the stand-alone applications processor market with its Snapdragon processors, Strategy Analytics reported.

 "Qualcomm has become the company to beat in the mobile chip market and is moving far ahead of most of its competitors," said Sravan Kundojjala, a senior analyst at Strategy Analytics.

Broadcom slips into top 5 in smartphone CPUs

Time for EDA to grow up Electronics News

The phrase Electronic Design Automation (EDA) was first coined to describe software that automated PCB layout and chip design. But the software has now evolved to such an extent that it’s hard to know what EDA really is anymore. The technology resembles a youth who’s reached the end of his formative years and is now looking for his true purpose in life.  

Companies such as Cadence, Synopsys and Mentor Graphics have defined the progression of EDA thus far, introducing evermore sophisticated software to allow design engineers to route, optimise and verify their electronics before a chip is placed or a solder joint made.

Today’s state-of-the-art systems allow digital designers to select modules from standard libraries of technology “cells” that they can build up to meet their project’s requirements. These cells are proven architecture, speeding design, improving yield and accelerating time-to-market. Analogue designers have it harder because it’s much more difficult to define “standard” components in that domain, but even here, things are moving ahead rapidly.

Altium has extending its software so every member of the design team can see exactly what’s happening across all design domains

Rob Irwin, Product Manager with Australian EDA vendor Altium, sums up the history nicely in his blog on the EEWeb portal. “If we hark back to the [early days of EDA], simply using the computer as a glorified drafting table didn’t really raise the abstraction level at which we could design,” notes Irwin.

“It just let us do what we’d always done, only a bit faster and more conveniently. It wasn’t until we used the computational power and logic available to automate processes and help make and enforce design decisions that we were able to move forward at the pace necessary to make the digital age a reality.”

So, job done then. Well, not quite, because today’s products aren’t just about laying out the electronics.

Inside the silo

Before EDA, chips and PCBs were routed by hand by taping out on sheets of acetate set up on light tables and then shrinking the resultant design by photographic techniques such that they could be used for manufacturing.

The first EDA programs automated this drafting procedure, but the real breakthrough came in the 80s with the introduction of the VLSI design philosophy. This methodology espoused the use of programming languages that the designer used to specify the performance he wanted from his chips and boards. The software then translated (or “compiled”) these instructions into the physical circuitry.

While undoubtedly improving electronics design efficiency, EDA has its drawbacks. For starters the software is complex, requiring a high level of expertise to operate, secondly it’s proprietary, meaning that it’s very difficult to swap from one vendor to another if disenchantment sets in, and third, attempts to integrate the electronics design with mechanical design and manufacturing have been patchy.

This last drawback has tended to reinforce a ‘silo mentality’ between the electronics design team and the mechanical and production engineers. There can even be divisions within the electronics design team itself between digital and analogue engineers, and hardware and software designers.

“This silo approach makes design tradeoffs extremely difficult,” says Mike Woodward, Communications Industry Marketing Manager with software modelling company The MathWorks.  “For example, the engineer may wish to use a cheaper power amplifier and correct for non-linearities using digital methods (for example, digital pre-distortion), something difficult to do with many design tools.

“Often, design tools are targeted at a single design domain (for example, analogue design) and don’t co-simulate well with tools for other design domains,” notes Woodward in an earlier article for Electronics News (see EN September 2010). “This makes interaction between engineering teams more difficult than it needs to be.”

Cadence has attempted to soothe the conflict between hardware and software engineers by introducing its System Development Suite. The company notes that the differentiator between modern electronic products is often the software.

“Conventional [design] flows require manual migration from hardware to software and from one development environment to another, which may take months,” the company notes on its website. “As a result, 50 percent of overall development time can be spent on system integration.”

“The System Development Suite … [enables a] seamless migration path through the design phases,” says Nimish Modi, Senior VP of the System Realization Group at Cadence. “This integrated flow … provides a significant breakthrough in addressing the challenges of early software development and hardware/software convergence, leading to a dramatic reduction in development schedules.”

Over the wall

But even when the electronics guys have got their act together, the end result could be “thrown over the wall” only to find that it bounces back weeks later because the packaged product runs too hot or a BGA can’t be reliably soldered.

In previous times a second iteration might have been possible, but with the pressure to produce ‘right-first-time’ designs to meet ever-shorter product cycles, those days are gone.

Some EDA vendors have reacted to customer pressure by attempting to add electro-mechanical and mechanical ‘modules’ to their products such that the electronics designers can take into account some of the challenges their colleagues will face further down the design chain.

Mentor Graphics’ Flomerics software allows the electronics designer to check the thermal performance of his design


Mentor Graphics, for example, acquired U.K. company Flomerics in October 2008. The computational fluid dynamics analysis company now forms the core of Mentor’s Mechanical Analysis Division. While Flomerics products can be turned to all forms of fluid flow, the primary advantage for Mentor is thermal analysis of electronics assemblies.

“Thermal analysis of today’s high powered, compact electronic products requires ever increasing sophisticated conduction and convection thermal analysis, for both the full enclosure and PCBs, during the design process to meet reliability and time-to-market goals,” said Henry Potts, a VP with Mentor, in a statement.

“As a supplier of design automation software, we must consider the entire product development process and provide analysis and collaboration tools wherever we can help our customers be more competitive.”

Altium’s Altium Designer product takes a similar approach with what the company describes as a “single, unified data model that lets every designer on a team see exactly what’s happening across all design domains – hardware, software and programmable hardware”.

“Productivity in electronics design is so much more than the speed to layout, reducing the numbers of prototypes, or the management of output files for manufacture,” noted Gerry Gaffney, regional CEO for the Americas at Altium, in a statement.

“All these design authoring features are, of course essential. But why create any type of prototype if you’re not sure whether it can be manufactured? Why know that a prototype board will fit its enclosure only to discover later that a changed component means that, suddenly, the production board does not?” asks Gaffney.

The top-down approach

EDA software has grown up in parallel with the electronics industry. That’s made it excellent for designing chips and boards, and latterly the software to drive those chips, but not so good at extending the design process beyond the electronics.

But electronics is rapidly moving beyond “electronic” products such as computers, TVs and mobile phones to become embedded into trains, planes, automobiles and, well, just about any modern product you can think of. And those products in turn are designed by software.

CAD/CAE companies could be looking to encompass electronics design in their software suites. (Courtesy: Autodesk)

As electronics has become more persuasive, the Computer Aided Design/Computer Aided Engineering (CAD/CAE) vendors - that until now have been concerned with designing jet engines and washing machines - are beginning to consider how to cope with the inevitable electronics content of their next products. They have not made their move yet, but a middleman, in the form of software modelling companies such as The MathWorks and National Instruments (NI) are pioneering the way.

The MathWorks promotes a model-based design approach based on its MATLAB and Simulink products. Model-based design allows engineers to construct a graphical representation of their system. But this graphical representation is more than just a visual model; it’s a dynamic environment that can be exercised with inputs so that engineers can simulate what will happen under real life operating conditions.

Simulink software uses functional blocks that accurately mimic the precise electrical or mechanical behaviour of the device they represent. MATLAB software provides the control engineer with access to a library of algorithms to aid the control design process. Observing the effect on the plant model and making changes to the algorithms until the model’s behaviour meets the specification optimises the control design.

The final step is to compile the optimised control regimes into C code and port to an MCU to control, for example, an engine management unit.

“The plant model allows design engineers to develop control laws for the machine and try them out via simulation,” Bradley Horton, principal applications engineer with The MathWorks Australia, told Electronics News in an earlier interview (see EN January 2010).

“There is no need to build expensive prototype hardware in order to test the control strategy – by simulation, Simulink and MATLAB enables control system development and early design verification.”

NI’s LabVIEW, launched in 1986 and now in its tenth incarnation, is a graphical programming environment used by millions of engineers and scientists to develop sophisticated measurement, test, and control systems using intuitive graphical icons and wires that resemble a flowchart.

“When combined with modular hardware, LabVIEW is the centrepiece of the NI approach to graphical system design,” said the company in a statement, “which provides a unified platform for designing, prototyping and deploying applications with maximum efficiency.”

“By using LabVIEW, we decreased our system development time by one-third compared to the time we spent with traditional approaches,” says Glenn Larkin, engineer for the National Ignition Facility (NIF) at Lawrence Livermore National Laboratory in the U.S.    

Systems engineering

Software modelling packages like MATLAB and LabVIEW aren’t capable of designing boards and chips but they do simplify the development of control regimes that can then be easily ported to microcontrollers. That puts the development of such regimes within the scope of engineers that aren’t expert in chip programming. And LabVIEW’s strength in the test arena allows for promising initiatives integrating design with test.

Such opportunities for seamless connections between design and manufacturing teams haven’t gone unnoticed by the EDA vendors.  

Mentor Graphics, for example, has worked to combine a product, SystemVision, with NI’s LabVIEW such that test engineers can develop test programs without waiting for physical prototypes.

“Mentor has long recognized the need to move test integration up in the design process,” said Darrell Teegarden, a Director with Mentor’s System Modeling Group in a statement. “[SystemVision] makes it easy to test the design implementation virtually. SVX provides a virtual prototype of the entire system, while LabVIEW implements test program development and execution.”

SystemVision enables the system designer to model systems and components with a virtual prototype and use simulation to perform analyses of electrical, mechanical and thermal sub-system. The process allows test bench development to be done in parallel with system development and prototyping, speeding time-to-market.

What next?

The EDA vendors have dominated electronics design from the mid-80s, but a systems-engineering approach to modern product design is putting their hegemony at risk. The traditional vendors are reacting by pushing their business model to encompass more of the design process, but progress is slow and fragmented.

OEMs no longer want to maintain separate departments with teams of electronic, mechanical and manufacturing engineers working in glorious isolation. That old-fashioned hierarchical approach to product design is too expensive, too slow and too prone to design re-runs.

What’s needed, nay demanded, is a combined engineering team working in seamless harmony. The manufacturers are demanding software that covers electronics chip and board design, mechanical packaging, verification, code development and compilation, and even modelling of the performance of the electronics in its target application.

It’s a big ask, but if an EDA vendor doesn’t grasp the nettle soon a software modelling company or CAD/CAE firm inevitably will. The result will be an early death for the pioneers of EDA rather than a blossoming from precocious youth into confident adulthood.


Time for EDA to grow up Electronics News

Video: Challenges on the path to Exascale computing




SAN FRANCISCO--Like the race to put man on the moon back in the 1960's, the race to achieve exascale computing is becoming a pressing, global ambition.

With governments, corporations and academics world-over hankering for more system speed to address critical challenges from climate change to cancer cures, the high performance computing industry is being pushed like never before to exceed the exaflops barrier before the end of the decade.

Reaching exascale effectively means computers should be able to perform a quintillion calculations per second, a number considered science fiction until not long ago.

While the goal is clear and the purpose of achieving exascale is underscored by the urgency of dealing with some of Earth's primary problems, the challenges and pitfalls on the path to exascale are numerous.
From limited power budgets, to floor space limitations, to the reliability of monster systems, the road to successfully achieving exascale is a long and difficult one.

Recently at the supercomputing show in Seattle, EE Times asked several of the biggest players in high performance computing to outline what they saw as the main challenges to Exascale. The following video gives you their answers.

(Best viewed in Firefox/Chrome)





Video: Challenges on the path to Exascale computing

New horned dinosaur announced nearly 100 years after discovery

The animal, named Spinops sternbergorum, lived approximately 76 million years ago in southern Alberta, Canada.

Spinops was a plant-eater that weighed around two tons when alive, a smaller cousin of Triceratops. A single large horn projected from the top of the nose, and a bony neck frill sported at least two long, backward-projecting spikes as well as two forward-curving hooks. These unique structures distinguish Spinops from related horned dinosaurs.

"I was amazed to learn the story behind these specimens, and how they went unstudied for so long," said Andrew Farke, Augustyn Family Curator of Paleontology at the Raymond M. Alf Museum of Paleontology, and lead author on the study naming Spinops. "This animal is an important addition to our understanding of horned dinosaur diversity and evolution," Farke continued.

Parts of the skulls of at least two Spinops were discovered in 1916 by Charles H. and Levi Sternberg, a father-and-son fossil collecting team. The Sternbergs recognized that their find represented a new species and sent the fossils to The Natural History Museum (London). However, the fossils were deemed too scrappy for exhibit, and consequently were shelved for decades. It wasn't until Farke and colleagues recognized the importance of the fossil that the bones were finally cleaned for study.

"This study highlights the importance of museum collections for understanding the history of our planet," commented Farke. "My colleagues and I were pleasantly surprised to find these fossils on the museum shelf, and even more astonished when we determined that they were a previously unknown species of dinosaur."

The name Spinops sternbergorum (pronounced "SPIN-ops stern-berg-OR-uhm") means "Sternbergs' spine face," referring to the headgear of the animal and honoring the original discoverers of the fossil. Although the face of Spinops is similar to its close relatives Centrosaurus and Styracosaurus, the unique anatomy of the bony neck frill gives scientists better insight into how this structure evolved. In particular, the fossils of Spinops clarify the identification of the long frill spikes common in some horned dinosaurs. Previously, scientists had inferred that these spikes evolved only once in the group. Careful study of Spinops, however,suggests that its spikes are located in a different position from that seen in most other horned dinosaurs, implying that the structures evolved independently. This finding allows a more accurate reconstruction of evolutionary relationships, and is being tested with additional study.

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New horned dinosaur announced nearly 100 years after discovery

EE Times' 20 hot technologies for 2012

Our picks

What follows is a list of 20 technologies EE Times editors think can bring big changes, and that we will be tracking during 2012.

Given the pace of technological change, limiting our list to 20 topics doesn't really do the subject justice but in many ways are topics embrace numerous others. Technology does not exist in a vacuum.  Ideas behind each technology are interconnected both conceptually – and sometimes physically – through engineers, consumers, companies, events and market trends.

The significance can sometimes be as simple as how a well-turned phrase catches the essence of a technology sector, such as the way system-on-chip (SoC) replaced application-specific integrated circuits (ASICs) as a descriptor, a decade ago. For instance, is today's "Internet of Things" the same or different from machine-to-machine communications? Whichever buzz phrase we choose, the key is whether the technology will enable products to succeed and markets to grow.

The pictures used with the topics are not necessarily new in 2011 but examples from the past that illustrate why we think these technologies will flourish in the future

Speaking of flourishing, if we have learned one thing from this year of natural and economic disasters, it is that there are always areas within electronics and semiconductors that can grow rapidly even when the overall market growth is limited. And those hot areas are enabled by hot technologies like these.


1. Microelectromechanical systems (MEMS)
EE Times' 20 hot technologies for 2012

Nvidia: ARM supercomputer to be more efficient than x86





SAN FRANCISCO--An ARM CPU is inherently more efficient than an x86 CPU and therefore best suited toward the high performance computing needs of the future, according to Nvidia Corp.

In a recent interview, Nvidia's Sumit Gupta, director of Tesla marketing, said the only real advantage to x86 systems was that they could run operating systems like Microsoft Windows faster, but that when it came to needing maximum performance on minimum power, ARM was the future, and therefore a better option for supercomputing.

ARM architecture, explained Gupta, emerged out of the embedded space, where power limitations were prevalent and where less than a watt of power was considered a norm. All performance was therefore constrained from the conceptual phase of the chip's design, forcing engineers to be especially creative about power efficiencies.

Intel and AMD's x86 architecture, on the other hand, had been designed with PCs in mind, and came from a world in which machines were typically plugged in to wall sockets and faced no real power limitations.

"The number one consideration for x86 has always been to make operating systems like Windows run much faster and to be able to respond to unpredictable tasks, such as a mouse-click or a keyboard entry," said Gupta, noting that the need for branch prediction and speculative execution was the reason x86 processors had such sizeable cache.

"It's a terrific processor for everyday computing, not the right device as we go towards high performance computing," he maintained.

Nvidia is already helping the Barcelona Supercomputing Center (BSC) to develop a hybrid supercomputer based on its Tegra ARM CPUs, accelerated by CUDA-supporting Tesla GPUs, with hopes of reaching exascale performance in a European project known as "Mont-Blanc".

The hybrid will be the world's first ARM-based CPU/GPU supercomputing combination, and researchers at BSC have said they hope to achieve a short term goal of a two to five times improvement in energy efficiency compared with today's most efficient systems, with an ultimate goal of reaching exascale at 15 to 30 times less power.

Should the proof of concept work, Nvidia may well prove its point, but success seems a few years away at this point. In the meanwhile, Nvidia said it will continue working on a development board for the HPC community which the firm hopes will kickstart the software ecosystem around the ARM architecture for the supercomputers of the future.




Nvidia: ARM supercomputer to be more efficient than x86

IEDM: UCB reports printed MEMS switches


LONDON – A team of researchers from the University of California Berkeley has a paper at the International Electron Devices Meeting (IEDM)that describes how to use an inkjet printer to print microelectromechanical system (MEMS) switches and proposes their use for flexible display backplanes.

The switch is of the electrostatically-operated cantilever beam type whereby a voltage on a gate electrode attracts the beam to close with a contact. The removal of the voltage allows the beam to spring back breaking contact. The total area of the device is about 1–mm by 1-mm although there is scope of scaling the manufacture.

Traditionally active-matrix switching for display backplanes has been done by amorphous silicon thin-film-transistors, although recently organic polymers have also been applied to the task. Both types of TFT suffer from some leakage current in the off-state and some resistance in the on-state. In their paper the UCB authors point out that their inkjet-printed MEMS switch has near ideal characteristics for the application of zero off-state leakage and on-state resistance of about 10 ohms.

The switch is made by repeated inkjet printing passes to build up conductive and insulator layers. A layer of polymethylmethacrylate (PMMA) is used as a sacrificial layer to separate the cantilever from the gate contact below.

The gate, drain and source electrodes are printed on to an oxidized silicon wafer using a silver particle ink. Cross-linked poly-4-vinylphenol (PVP) is baked at 180 degrees C for 30 min to form an insulating gate dielectric layer. The drain electrode is thickened using in the contacting region by multiple print cycles. The PMMA thickness is about 2-microns.

The source beam is about 100-micron wide by 550-micron long and printed on top of the sacrificial PMMA. The thickness of the beam is also built up by repeated printing at about 450-nm per printed later. The researchers report that they found the beam needed to be greater than 1.6-microns thick to avoid failure. The last manufacturing step is the selective removal of the PMMA using acetone at 50 degrees C.

The researchers conclude that the device has moderate switching delay of approximately 10 microseconds and that with dimensional scaling the performance should be suitablefor video-rate active-matrix display applications. The low thermal process budget also makes inkjet-printed MEMS technology a potential candidate for large-area systems on glass.

IEDM is taking place in Washington DC from Dec. 5 to 7.


Related links and articles:

MEMS transistor integrated on CMOS


Crystalline alloy boosts piezo MEMS operation

IDT claims first piezoelectric MEMs

MEMS startup raises $75 million with IPO


IEDM: UCB reports printed MEMS switches

Acquired traits can be inherited via small RNAs

The study is slated to appear in the Dec. 9 issue of Cell.

"In our study, roundworms that developed resistance to a virus were able to pass along that immunity to their progeny for many consecutive generations," reported lead author Oded Rechavi, PhD, associate research scientist in biochemistry and molecular biophysics at CUMC. "The immunity was transferred in the form of small viral-silencing agents called viRNAs, working independently of the organism's genome."

In an early theory of evolution, Jean Baptiste Larmarck (1744-1829) proposed that species evolve when individuals adapt to their environment and transmit those acquired traits to their offspring. For example, giraffes developed elongated long necks as they stretched to feed on the leaves of high trees, an acquired advantage that was inherited by subsequent generations. In contrast, Charles Darwin (1809-1882) later theorized that random mutations that offer an organism a competitive advantage drive a species' evolution. In the case of the giraffe, individuals that happened to have slightly longer necks had a better chance of securing food and thus were able to have more offspring. The subsequent discovery of hereditary genetics supported Darwin's theory, and Lamarck's ideas faded into obscurity.

However, some evidence suggests that acquired traits can be inherited. "The classic example is the Dutch famine of World War II," said Dr. Rechavi. "Starving mothers who gave birth during the famine had children who were more susceptible to obesity and other metabolic disorders -- and so were their grandchildren." Controlled experiments have shown similar results, including a recent study in rats demonstrating that chronic high-fat diets in fathers result in obesity in their female offspring.

Nevertheless, Lamarckian inheritance has remained controversial, and no one has been able to describe a plausible biological mechanism, according to study leader Oliver Hobert, PhD, professor of biochemistry and molecular biophysics and a Howard Hughes Medical Institute Investigator at CUMC.

Dr. Hobert suspected that RNA interference (RNAi) might be involved in the inheritance of acquired traits. RNAi is a natural process that cells use to turn down, or silence, specific genes. It is commonly employed by organisms to fend off viruses and other genomic parasites. RNAi works by destroying mRNA, the molecular messengers that carry information coded in a gene to the cell's protein-making machinery. Without its mRNA, a gene is essentially inactive.

RNAi is triggered by doubled-stranded RNA (dsRNA), which is not found in healthy cells. When dsRNA molecules (for example, from a virus) enter a cell, they are sliced into small fragments, which guide the cell's RNAi machinery to find mRNAs that match the genetic sequence of the fragments. The machinery then degrades these mRNAs, in effect destroying their messages and silencing the corresponding gene.

RNAi can be also triggered artificially by administering exogenous (externally derived) dsRNA. Intriguingly, the resultant gene-silencing occurs not only in the treated animal, but also in its offspring. However, it was not clear whether this effect is due to the inheritance of RNAs or to changes in the organism's genome -- or whether this effect has any biological relevance.

To look further into these phenomena, the CUMC researchers turned to the roundworm (C. elegans). The roundworm has an unusual ability to fight viruses, which it does using RNAi.

In the current study, the researchers infected roundworms with Flock House virus (the only virus known to infect C. elegans) and then bred the worms in such a way that some of their progeny had nonfunctional RNAi machinery. When those progeny were exposed to the virus, they were still able to defend themselves. "We followed the worms for more than one hundred generations -- close to a year -- and the effect still persisted," said Dr. Rechavi.

The experiments were designed so that the worms could not have acquired viral resistance through genetic mutations. The researchers concluded that the ability to fend off the virus was "memorized" in the form of small viral RNA molecules, which were then passed to subsequent generations in somatic cells, not exclusively along the germ line.

According to the CUMC researchers, Lamarckian inheritance may provide adaptive advantages to an animal. "Sometimes, it is beneficial for an organism to not have a gene expressed," explained Dr. Hobert. "The classic, Darwinian way this occurs is through a mutation, so that the gene is silenced either in every cell or in specific cell types in subsequent generations. While this is obviously happening a lot, one can envision scenarios in which it may be more advantageous for an organism to hold onto that gene and pass on the ability to silence the gene only when challenged with a specific threat. Our study demonstrates that this can be done in a completely new way: through the transmission of extrachromosomal information. The beauty of this approach is that it's reversible."

Any therapeutic implications of the findings are a long way off, Dr. Rechavi added. "The basic components of the RNAi machinery exist throughout the animal kingdom, including humans. Worms have an extra component, giving them a much stronger RNAi response. Theoretically, if that component could be incorporated in humans, then maybe we could improve our immunity and even our children's immunity."

The CUMC team is currently examining whether other traits are also inherited through small RNAs. "In one experiment, we are going to replicate the Dutch famine in a Petri dish," said Dr. Rechavi. "We are going to starve the worms and see whether, as a result of starvation, we see small RNAs being generated and passed to the next generation." 

This research was supported by the Howard Hughes Medical Institute and Gruss Lipper and Bikura Fellowships to Oded Rechavi.

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Acquired traits can be inherited via small RNAs

Qualcomm announces powerline chip

SAN JOSE, Calif. – Qualcomm Atheros has announced the first powerline transceiver based on the Green PHY specification of the HomePlug group. The chip is the latest entrant in the race to create smart energy networks.

Powerline specialist Intellon started the design of what has become the QCA7000 before it was acquired by Atheros in September 2009, then acquired in turn by Qualcomm in January. Intellon secured a grant to develop the chip as part of the U.S. technology stimulus aimed at boosting work in smart electric grids.

To date, Zigbee has won most of the sockets for networking smart meters to devices in the home and back-end utility networks. However, utilities have not activated the Zigbee connections on most smart meters, waiting for standards to develop that will create an ecosystem of devices and software to enable smart electric nets in the home.

The Smart Energy Profile 2.0 now in development aims to enable any kind of wired or wireless network supporting Internet Protocol. It won backing from proponents of ITU G.hn, powerline, Wi-Fi and Zigbee networks.

Makers of energy-hungry white goods such as refrigerators and dryers have yet to embed networking in their products. They are waiting for standards to shake out and costs to fall before taking the plunge.

A handful of chip makers helped draft the Green PHY specification including Arkados, Gigle (now part of Broadcom), Marvell, Renesas, Spidcom and ST Microelectronics. They will likely compete with Qualcomm for sockets in smart electric networks.

A handful of chip makers helped draft the Green PHY specification including Arkados, Gigle (now part of Broadcom), Marvell, Renesas, Spidcom and ST Microelectronics. They will likely compete with Qualcomm for sockets in smart electric networks.

The QCA7000 is a single chip supporting the Green PHY spec that delivers about a Mbit/second of applications layer throughput. It packs a power management unit, analog front end and memory in an 8x8mm QFN package.

The chip supports SPI and UART host interfaces, a GPIO bus and an optional flash interface to link to smart plugs and monitoring sensors.

Qualcomm hopes it finds a wide variety of uses in plug-in electrical vehicles, smart energy nets and remote monitoring applications. Samples of the QCA7000 chip are available now with volume production scheduled for early 2012.

The Green PHY spec supports the IEEE 1901 standard. It is a subset of the HomePlug AV powerline networking spec that supports data rates up to 200 Mbits/s.


Qualcomm announces powerline chip

Intel, Micron offer 128-Gbit NAND flash memory



LONDON – Intel Corp. and Micron Technology Inc. have announced the development of a 128-Gbit NAND flash memory made using an improved 20-nm manufacturing process technology for flash that includes high-K metal gate (HKMG) transistors.

The companies claimed it is the world's first monolithic 128-Gbit memory and said they are going into mass production of a 64-Gbit 20-nm NAND flash part in the same process immediately and expect to ramp production of the 128-Gbit device in the first half of 2012.

Intel and Micron did not describe the process as being 20-nm class, something that other manufacturers have done to refer to process that is somewhere between 20- and 29-nm. It has previously been reported that Intel and Micron had a 64-Gbit NAND flash was implemented in a 25-nm process.

The latest parts were developed at Intel and Micron's joint venture, IM Flash Technologies (IMFT). The 128-Gbit memory uses multilevel sensing in each cell, although the companies did not indicate how many bits per cell. The companies also said the part is the first to use a planar cell structure that overcomes scaling constraints on standard floating-gate NAND flash memories by integrating the HKMG gate stack on NAND production. HKMG gate-stack transistors have been in used by Intel for logic processes for several nodes, but this is believed to tbe the first application to a memory component.

Intel and Micron said they are ramping production of the 20-nm 64-Gbit NAND flash memory in December and would expect a rapid transition to the 128-Gbit device in 2012. Samples of the 128-Gbit device will be available in January, followed by mass production in 1H12.

The 128-Gbit memory meets the supports 333 megatransfers per second supporting applications in smartphones, tablet computers and solid-state drives. For modules eight 128-Gbit die will provide a terabit of storage.

"It is gratifying to see the continued NAND leadership from the Intel-Micron joint development with yet more firsts as our manufacturing teams deliver these high-density, low-cost, compute-quality 20-nm NAND devices," said Rob Crooke, Intel vice president and general manager of Intel's non-volatile memory solutions division.


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Intel, Micron offer 128-Gbit NAND flash memory

Ancient meat-loving predators survived for 35 million years

A detailed description of a fossil that scientists identify as a varanopid "pelycosaur" is published in the December issue of Naturwissenschaften -- The Science of Nature. Professors Sean Modesto from Cape Breton University, and Robert Reisz from the University of Toronto Mississauga, provide evidence that a group of ancient, agile predators called varanopids survived for more than 35 million years, and co-existed with more advanced animals.

Modesto and the team performed a detailed examination of the partial skull and jaw of the youngest known primitive mammal-like animal, which they believe lived over 260 million years ago in the Permian Period. The fossils are from rocks forming the Pristerognathus Assemblage Zone of the Beaufort Group in South Africa.

"These animals were the most agile predators of their time, sleek-looking when compared to their contemporaries," says Reisz. "They seem to have survived a major change in the terrestrial fauna that occurred during the Middle Permian, a poorly understood extinction event in the history of life on land."

According to Modesto, "These ancient animals really looked like modern goannas or monitor lizards, but are actually more closely related to mammals."

The fossil revealed teeth that are strongly flattened, curved towards the throat and with finely serrated cutting edges typical of hypercarnivores -- animals with a diet that consists of more than 70 percent meat.

Modesto and his colleagues concluded that these varanopids had a longer co-existence with animals that eventually evolved into mammals than previously believed. They suggest that the dental and skeletal design of varanopids, reminiscent of the Komodo dragon of today, may have contributed to their long survival and their success.

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Ancient meat-loving predators survived for 35 million years

2011-12-06

Samsung plans China NAND flash wafer fab


LONDON – Samsung Electronics Co. Ltd., has said it is seeking permission to build a NAND flash memory wafer fab in China and get it running in 2013, according to local reports. The location has not been decided the reports said.

Samsung is expected to spend about $4 billion to bring up a plant to service the Chinese makers of smartphones and tablet computers. The plant would likely begin production with a 20-nm class manufacturing process, the reports said.

Market research firm Gartner Inc. expects the global NAND flash market to grow 20.6 percent in 2011 to reach a size of about $25 billion. It is forecasting 14 percent annual growth in each of 2012 and 2013 to take the market to $28.7 billion and $32.7 billion, respectively.

The wafer fab plan has to be approved by South Korea government. If approved the fab, "will enable us to meet fast growing demand from our customers and at the same time strengthen our overall competitiveness in the memory industry," a Reuters report quoted Jun Dong-Soo, president of Samsung's memory business, as saying.

Samsung is said to be the world's largest supplier of NAND flash memory with about a 40 percent market share.

Samsung recently fired up the world's largest memory fab in Korea. It's Line-16 megafab is expected to eventually produce NAND flash on 200,000 wafers of 300-mm diameter monthly and the phased investment is expected to total approximately 12 trillion won (about $10 billion) to completion. Samsung began mass production of 20-nm-class NAND flash memory at a rate of about 10,000 300-mm wafers per month in September.


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Samsung plans China NAND flash wafer fab