SAN FRANCISCO—Technology licensor Rambus Inc. said Wednesday (Dec. 15) it is engaging Taiwan's Industrial Technology Research Institute (ITRI) on the development of interconnect and 3-D packaging technologies.
The work will initially focus on the development of system integration using silicon interposer technology, Rambus said.
Rambus (Sunnyvale, Calif.) also announced that it joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI. Rambus and ITRI will work together as members of Ad-STAC on the development of system integration using silicon interposer technology, the company said.
According to Ramsbus, the collaboration combines ITRI’s strength in manufacturing and advanced process technologies with the system, package and signaling design experience of Rambus.
"Collaborating with leading research institutions, such as ITRI, is an effective way for us to advance 3-D packaging technology for the broader manufacturing community," said John Kent, vice president of technology development at Rambus, in a statement.
Rambus, ITRI to collaborate on 3-D packaging
No comments:
Post a Comment