2011-12-06

IBM demos racetrack memory and nanotech chips Electronics News

IBM introduced a number of research breakthrough at the IEEE International Electron Devices Meeting.

According to IBM, these advancements could lead to dramatically smaller, faster and more powerful computer chips, allowing the industry to surpass Moore’s Law.

With virtually all electronic equipment today built on complementary-symmetry metal–oxide–semiconductor (CMOS) technology, there is an urgent need for new materials and circuit architecture designs compatible with this engineering process as the technology industry nears physical scalability limits of the silicon transistor.  

IBM says it has successfully integrated the development and application of new materials and logic architectures on 200mm (eight inch) diameter wafers.

Racetrack Memory



Racetrack memory combines the benefits of magnetic hard drives and solid-state memory to overcome challenges of growing memory demands and shrinking devices.

IBM researchers are proving the feasibility of Racetrack memory by detailing the first of these sorts of devices integrated with CMOS technology on 200mm wafers.

They have demonstrated read and write functionality on an array of 256 in-plane, magnetized horizontal racetracks. Eventually, the density will be boosted using perpendicular magnetized racetracks and three-dimensional architectures.

Graphene

This first-ever CMOS-compatible graphene device can advance wireless communications, and enable new, high frequency devices, which can operate under adverse temperature and radiation conditions in areas such as security and medical applications.

The graphene integrated circuit, a frequency multiplier, is operational up to 5 GHz and stable up to 200 degrees Celcius. While detailed thermal stability still needs to be evaluated, these results are promising for graphene circuits to be used in high temperature environments.

New architecture flips the current graphene transistor structure on its head. Instead of trying to deposit gate dielectric on an inert graphene surface, the researchers developed a novel embedded gate structure that enables high device yield on a 200mm wafer.

Carbon Nanotubes

IBM researchers also demonstrated the first transistor with sub-10 nm channel lengths, which outperform the best of the comparable silicon-based devices currently in existence.

At channel lengths below 10nm, conventional silicon technology will face extreme performance difficulties even with new advanced device architectures.

The scaled carbon nanotube devices below 10nm gate length are a significant breakthrough for future applications in computing technology.

The carbon nanotube devices have improved switching speed in the on-state, as well as excellent off-state behaviour.


IBM demos racetrack memory and nanotech chips Electronics News

Assembly in the field is a must for plug connectors Electronics News

Plug Connectors For High-Speed Networks - Assembly In The Field Is A Must

Whether Industrial Ethernet or classic fieldbus systems - the demands placed on the capability and performance of field cabling are increasing. While preassembled cabling systems are used in the office environment without giving it a second thought, in industry the connection must often be individually tailored to the application. In this case, it is irrelevant whether it involves an RJ45, and M12 or an SCRJ-based connection system.


Figure 1 - Whether RJ45, M12 or SCRJ - fast and cost-effective installation in the field is an absolute must.

In the future-oriented industrial environment, the boundaries between the different automation systems are becoming increasingly fuzzier. The "Integrated Automation Network" has a bracket function around the fieldbus applications - known as "the Automation Island networks" - and integrates other participants outside fieldbus systems. In addition, other devices that operate with high data transfer rates are integrated in the Automation Island for communication and data acquisition. Here the name of the game is simple and cost-effective installation.

Copper Or Fibre-Optic Cable

Industrial communications frequently have to cope with harsh application conditions. When selecting components, users not only have to consider the transmission-related properties but also the environmental conditions. Will the installation be inside or outside a control cabinet? What requirements apply regarding shielding and potential bonding? These factors have a huge impact on the network reliability. Optical connections should be selected if there is no correct potential bonding system or the EMC effects generate inadmissibly high interference voltages. A comprehensive range of products, as offered by Phoenix Contact, includes the optimum solution for each and every environment.

Assembly In The Field For Copper-Based Systems

Independent of the plug connector system, the various fast connection technologies - such as QUICKON, Piercecon or spring cage - are increasingly establishing themselves. They are displacing crimp and solder connections and the classic screw connection. As copper-based Ethernet systems involve a point-to-point connection with a total maximum length of 100 m and several plug-in points, reliable and cost-effective assembly is an absolute must.


Figure 2: Insert the conductor, cut and close the flap - the RJ45 and M12 connectors facilitate fast and reliable installation.

Phoenix also offers the optimum solutions here. RJ45 QUICKON connectors, M12 QUICKON with data transmission rates of 1 gigabit per second or the 10-gigabit high-speed connectors with Pierecon and QUICKON connections are suitable for standard copper-based installation (Fig. 2). The fast connection technology allows cost-effective and reliable installation without having to use a special tool. This technology can be used for all industrial Ethernet transmission systems - from Ethernet-based field buses such as Profinet and Ethernet/IP up to the 10 gigabit Ethernet.

POF, HCS, GOF - The Reliable Connection Is What Counts

The SCRJ plug connector from Phoenix Contact is the first fibre-optic cable connector in protection classes IP20 and IP67 that can be reliably and quickly assembled in the field. It does not matter what type of fibre is used: whether polymer fibre, hard clad silica or glass fibre, the correct tool facilitates a straightforward connection even when employing sensitive technologies.

POF - Polymer Fibre

Polymer fibre is used for industrial-grade fast Ethernet cabling with transmission lengths of up to 50 meters and is therefore often installed in environments where there are machines. Polymer fibres in SCRJ connectors can be reliably and cost-effectively connected using the Cut-Tool that has been newly developed by Phoenix Contact for this purpose. After the cable has been prepared, both fibres are cut to the same length using the tool and then individually processed. A knife specifically developed for this cuts the face surface so precisely that subsequent processing is not required. This tool is also used to precisely cut-off the fibres for mounting in the ferrules in just a few simple steps. Depending on the plug connector type, only the housing has to be assembled.


Figure 3: Tool for assembling POF fibres - introduce the fibre, cut and assemble in the SCRJ ferrule, polishing is not required.

The Cut-Tool can be used with all SCRJ connectors: IP20, IP67 wing connectors or IP67 push-pull. Even traditional pre-assembled cables facilitate reliable and fast installation in the field.

HCS - Hard Clad Silica

An appropriate tool is also available for assembling HCS fibres in the field. F-SMA and SCRJ plug connector types are used for 660 nm as well as type B-FOC for 850 nm devices. Suitable connector assemblies are available for all of the commercially available plug connectors.

The assembly cases include all of the parts and components required for optimally working in the field. After the cable has been appropriately prepared, the fibre jacket is removed, the fibres cleaved using a special tool called the “cleave tool” and carefully broken. Finally, only the connector has to be assembled.

GOF - Glass Fibre

For SCRJ and SC duplex plug connectors, Phoenix Contact uses the adhesive principle for assembly in the field. The set includes all tools required for assembling these connectors in the field, which are kept in a tool pouch that has been specifically designed for this purpose. The set is easy to use even under challenging work conditions. The fibres can be connected to the connector in a convenient way: the ferrule assembly is inserted in the tool; adhesive powder is applied to the exposed fibre, and after briefly heating up the ferrule the fibres are inserted into it. The device optically and acoustically signals all of the work steps. Using the tool, the fibres are then precisely scored and broken. The operation is completed by just polishing the fibre ends.

For all assembly types - whether POF, HCS or GOF - the quality of the face surface is decisive. The handheld microscope, provided in the set, can be used to evaluate the surface quality. With these steps completed, the network can go reliably into operation.

Conclusion

State-of-the-art automation solutions overcome the boundaries between fieldbus and communication networks. Here, the use of high-speed connectors plays a decisive role. “High-speed” refers not only to a data transmission rate of 10 gigabit per second but also to the ability to be assembled in the field. This means that fit-for-the-future networks can be efficiently set up and installed in the field using QUICKON, Piercecon or SCRJ plug connectors.

Phoenix Contact is a leading developer and manufacturer of industrial electrical and electronic technology. Founded more than 80 years ago in Essen, Germany, Phoenix Contact has been operating in Australia and New Zealand since 1996. Australia's diverse industries including mining, dairy industries, manufacturing, transport and process and control industry are technical environments that require a high degree of expertise and face to face support to satisfy the demands of our customers. Outstanding German engineered products together with strong local support build the foundation of success for users and supplier. This global company has over 12 000 employees, located in 40 subsidiaries worldwide.

FURTHER READING


Assembly in the field is a must for plug connectors Electronics News

Startups get a better deal Electronics News

STARTING from 7 December, Australian entrepreneurs will no longer have to repay Early Stage Commercialisation grants for businesses developing a new product, process, or service.

The government has also raised the annual turnover limit for applicants for the grants from $20 million to $50 million, allowing a greater subset of startups and businesses to get a grant.

To encourage the injection of skilled managers into startups, the government says these businesses also have the option to apply for an upgraded Experienced Executives grant of up to $350,000 – up from $200,000.

Innovation Minister Senator Kim Carr claims these changes to Commercialisation Australia’s grants will give Australian inventions a better chance of flourishing in the market place.

Almost 180 innovators have already benefited from grants of $71.7 million from Commercialisation Australia, as well as expert advice from experienced case managers, to help turn their inventions into marketable products and services.

The eligible expenditure guidelines for Early Stage Commercialisation grants will be amended to provide broader support for the development of pilot manufacturing plants and innovative manufacturing facilities.


Startups get a better deal Electronics News

Selecting the most appropriate relay Electronics News

Choosing the most suitable relay for process control systems and industrial automation applications can be perplexing given the enormous variety of relays that are available on the market today.

By far, the most common type of relay in use is the electro-mechanical relay. It consists of an electrical component, the coil, and a mechanical part, the contact. The inherent simplicity of the electro-mechanical relay and its low cost, has lead to its use in nearly every switching process for inputs and outputs of control systems.

In the case of electro-mechanical relays, coil voltages are available for all industrial requirements from 5VDC to 240VAC. Engineers and technicians can also choose from contacts that switch up to 16A. The contacts can be arranged as normally open, normally closed or as a changeover, and in groups of 1 to 6 poles.

Electro-mechanical relays tend to be highly reliable and can operate for years without malfunctioning. They are best suited to applications that require switching up to five times per minute. They are ideal for standard industrial use for PLC/DCS output 0.5 to 10A resistive load and where isolation up to 4kV is required.

Typically, electro mechanical relays tend to have a contact made of silver tin oxide. This is a very hardwearing material but is designed for minimum switching levels of at least 12V@100mA. To meet the needs of low level switching, relay manufacturers developed gold plated contacts. The contact material features a plating of around 5um of pure gold.

As gold does not tarnish and has the lowest resistance, signals can be switched down to 100mV at 100uA to accommodate most low-level signals. If the relays are required to switch at high speeds or for a very long duration then solid state relays are a more appropriate option. This is because high speed switching leads to deformation of the contact and overheating of the coil in electro-mechanical relays.

Purposely designed to meet the needs of high speed switching, solid state relays incorporate Triac and MOSFET technology. A device called an opto-coupler which is a light emitting diode adjacent to a photosensitive transistor has replaced the coil.

When the LED is energised it produces light that falls on the transistor and causes it to switch on. Depending on the output configuration triacs are used to switch AC and MOSFETs to switch DC. The solid state relay incorporates no moving parts eliminating the possibility of wear and tear.

Extremely reliable, solid state relays should last the life of the installation. They are perfect for applications that require switching at more than 5 times per minute up to 100kHz.

They are available specifically as input devices with switching capacities of up to 100mA or as output devices switching up to 10A inductive loads.

For more information about relays contact Weidmuller on free call 1800 739 988 or email.


Selecting the most appropriate relay Electronics News

Synopsys boosts EDA capabilities with acquisition Electronics News

SYNOPSYS, which provides software and IP used in the design, verification and manufacture of electronic components and systems, will acquire Magma Design Automation.

Magma Design Automation provides chip design software and is headquartered in California.

According to the companies, the acquisition brings together their complementary technology, development and support capabilities, allowing the combined company to more rapidly meet customer requirements linked to chip designs at both leading-edge and mature process nodes.

Synopsys says the dramatic rise in complexity of today's semiconductor designs for all process nodes requires an equally dramatic increase in designer productivity.

It says its customers are now dealing with the very complex physics of 20-nanometer design or they are squeezing the last bit of performance and cost from designs at mature, high-value nodes. As such, EDA software needs to keep up with offered capabilities to ensure customers’ success.


Synopsys boosts EDA capabilities with acquisition Electronics News

AMD offers Fusion APUs as alternative accelerators for supercomputing



MOUNTAIN VIEW, Calif.--While Intel Corp. and Nvidia Corp. engage in a war of words over which architecture best suits high performance computing –graphics cards or many integrated cores (MIC)—rival chip designer Advanced Micro Devices (AMD) is offering up its own Fusion architecture for consideration, and some vendors are already taking the bait.

Penguin Computing Inc., for instance, recently installed the world's first HPC Accelerated Processing Unit (APU) cluster based on AMD's architecture at Sandia National Labs in Albuquerque, New Mexico.

The experimental system, known as Altus 2A00, sports 104 nodes interconnected using QDR Infiniband fabric, purportedly able to reach a peak performance of 59.6 TFLOPs.

APUs are something of a hybrid between CPUs and GPUs, combining  multi-core x86 processing, memory controllers, a massively parallel  and a PCI-E interface, all on one piece of silicon.

"APUs are interesting for a different class of problems; problems that accelerate well with a GPU," explained Penguin CTO Phil Pokorny, when he spoke to EE Times recently at SC11 in Seattle, Washington.

With the CPU and GPU fused together into one core sharing a common memory controller, said Pokorny, APUs mean applications need not be limited to the two, four or six gigabytes of memory on a GPU card, instead being able to access all host memory. On the Sandia system, this means applications have access to some 16GBs of RAM.

APUs boast some 400 parallel processing cores which can be programmed using the OpenCL framework, which is simpler than some other programming models, said Pokorny, adding that owing to the APU's fused chip structure, a lot of bottlenecks and duplication of data was likewise avoided.  

While an interesting option, however, Penguin Computing is not staking all of its hopes on APUs, despite its status as an "elite partner" in the AMD Fusion partner program.

The firm, which started out in the market for Linux servers a decade ago, has also delivered HPC clusters based on AMD's new Interlagos chips to market.

The new Opteron 6200 and 4200 series –which can boast up to 16 cores per processor-- are in Penguin's refreshed Altus server line, as well as in a couple of clusters delivered to both Georgia Tech and the at University of Delaware.

Delaware's cluster is made up of 200 compute servers, interconnected through QDR InfiniBand with a potential peak performance of 49.3 TFLOPs and aggregate memory capacity of 13.5TB. The integrated quad channel DDR3 memory controllers ensure clock speeds of up to 1866MHz, more than capable of supporting the high core density.

Pokorny explained that AMD had also added FMA4 to the Bulldozer architecture, on which the new Opterons are made, meaning that the chips can perform twice as many floating point operations per clock cycle.

You can hear more of Pokorny's interview with EE Times in the video.



AMD offers Fusion APUs as alternative accelerators for supercomputing

TSMC hands out 2011 supplier awards

SAN FRANCISCO—Foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) recognized 12 equipment and materials suppliers at its annual supply chain management forum last week.

More than 400 suppliers around the world in the fields of equipment, materials, packaging, testing, facilities, IT systems and services, export/import services, and environmental and waste management services participated in the forum, TSMC (Hsinchu, Taiwan) said.

"TSMC is a semiconductor industry leader because of our three competitive advantages: technology leadership, manufacturing excellence, and customer trust," said TSMC Chairman Dr. Morris Chang. "TSMC's success comes from its close collaboration with customers and supplier partners, and we will continue to work together and push technology forward for the sustainable growth of the semiconductor industry."

In addition to recognizing suppliers' overall performance with its "Supplier Excellence" awards, TSMC this year also established the "Supplier Achievement Award," which was given to Dainippon Screen Manufacturing Co. Ltd. for environmental excellence and Greene, Tweed & Co. for supply chain resilience, TSMC said.

The 2011 award winners are as follows:

Supplier Excellence Award
Applied Materials, Inc. – Excellent Productivity, PVD Equipment
ASML Holding N.V. – Excellent Service, Lithography Equipment
Tokyo Electron Ltd. – Excellent Delivery Support
Lam Research Corp. – Excellent Technology Development Collaboration, Etching Equipment
KLA-Tencor Corp. – Excellent Performance, Mask Inspection Equipment
SUMCO Corp. – Excellent Performance, Silicon Wafer Material
BASF SE – Excellent Technology Development Collaboration, Chemical Material
Linde LienHwa – Excellent Performance, Gas Material
Dow Chemical – Excellent Performance, CMP Material
JX Nippon Mining & Metals – Excellent Delivery Support, Target Material

Supplier Achievement Award
Dainippon Screen Mfg. Co., Ltd – Environmental Excellence
Greene, Tweed & Co. – Local Presence for Supply Chain Resilience


TSMC hands out 2011 supplier awards

Chinese firm offers sub-$100 Android 4.0 tablet

SAN FRANCISCO—A Chinese consumer electronics firm is offering for sale a media tablet based on Android 4.0 for less than $100, MIPS Technologies Inc. said Monday (Dec. 5).

The tablet, which is available in China and online through Ainol Electronics Co. Ltd., features a 7-inch capacitive multi-touch screen and is powered by a MIPS-based processor from China's Ingenic Semiconductor Co. Ltd. The tablet supports WiFi 802.11 b/g/n, USB 2.0, HDMI 1.3 and microSD, as well as 3-D graphics with the Vivante GC860 GPU, 1080p video decoding and dual front/rear cameras.

The tablet, NOVO7, is the first tablet based on Android 4.0, also known as Ice Cream Sandwich. It will be available in the U.S. and other geographies within the next several months under brands from companies including Leader International Inc. and OMG Electronics Ltd. It will also eventually be available in 8- and 9-inch form factors, according to MIPS.

According to Robert Bismuth, vice president of business development at MIPS, the functionality of the NOVO7 is roughly equivalent to Amazon's Kindle Fire, which is sold directly through Amazon for $199.

Bismuth said the company is working with other customers that will be bringing to market MIPS-based applications processors for tablets based on Android 4.0. Bismuth said the sub-$100 price point of the tablets is likely to be a sign of things to come. "The price advantage that the MIPS architecture brings to licenses helps to drive down the cost of all devices we are in," Bismuth added.

Bismuth pointed to an interesting proof point from recent history that underscores consumer interest in lower cost media tablets. When Hewlett-Packard Co. announced in August that it would discontinue its TouchPad tablets after just weeks on the market, it lowered the price point on the devices it still had in stock to $99 and $129. Consumers snapped them up within 48 hours.

"There was no future for [TouchPad]—no future support or future apps," Bismuth said. "But it did the four or five things that people wanted."



Chinese firm offers sub-$100 Android 4.0 tablet

Dealer sees hard drive prices ease

SAN JOSE, Calif. – Prices of hard disk drives are on the decline following floods in Thailand, but they are not yet at back at historical levels, according to an executive with one unauthorized distributor.

"We've seen a lot of calming in the entire situation in the last couple weeks," said Lee Ackerley, a director and co-founder of N.F. Smith & Associates (Houston), an independent component dealer. Prices "have come back down and evened off, but they are not back to original prices," he said.

It could take until after the holiday buying season before anyone knows at what point shortages will abate. The floods also affected some sole-sourced resistors and capacitors used in hard disks and cars, he said.

"The PC industry definitely showed agility moving from one [hard disk] density to another, quickly specifying other parts according to their availability--it was pretty impressive," he said.

Last week hard drive maker Western Digital reported it has been able to re-open one of its Thailand facilities. It also raised its quarterly earnings forecast to $1.8 billion from 1.25 billion.

Meanwhile, Ackerley is forecasting a solid year in 2012 for Smith & Associates with plans to open new offices in Sao Paulo and India. "It's finally reached the point where it makes sense for us to have our own office there," he said.

The operations will initially be modest sales and warehouse facilities for the private company that employees 320 people and has annual revenues hovering around $400 million. "We are pushing to take the company to a billion dollars the by end of the decade," he said.


Dealer sees hard drive prices ease

Do machines dream of IoT?



Whether you want to call it the Internet of Things or machine-to-machine communications or shorten those buzz phrases to IoT or M2M, the application in this way of what are now the relatively mainstream technologies of IP addresses and wireless communication will change the world forever.

The ability of many – or even most – objects to be embedded in the 'cloud' is going to change the nature of those objects and their derivatives. And the M2M dialogs will be done in a stealthy way, which many have disquieting echoes of the cell phone key tracking incident that is playing out as I write.

It would be easy to oversimplify the situation but before we do it must be remembered that machine-to-machine communication has the potential to do almost unlimitless good in the world, if harnessed up appropriately.

Freescale Semiconductor, recently held a one-day conference on the topic in East Kilbride, Scotland, attended by executives from Oracle, IBM, Google and others. It is trying to get close to the multidisciplinary teams that will be needed to create beneficial, reliable and secure M2M/IoT applications.

For example, Freescale estimates there are 1.2 million road deaths a year around the world. Imagine the benefit of car-to-car communications that could apply brakes faster than drivers behind the wheel and closer to the ABS optimum to shorten stopping distances and avoid collisions.

Considerations of this and many other potential applications lead to the inescapable understanding that an M2M revolution, if it is to come, will be predicated on developments in wireless networks and security.
Next: Machine knows best
Do machines dream of IoT?

Qualcomm unveils health subsidiary, cloud hub

MOUNTAIN VIEW, Calif.--Qualcomm Inc. has announced the spin-off of its wireless health division into a wholly owned subsidiary called Qualcomm Life Inc. The firm said Qualcomm Life would be in charge of a $100 million fund, managed by Qualcomm Ventures, to invest in wireless health technologies.

The first technology offering from the newly formed subsidiary is the 2net Platform and Hub, which connects wireless medical devices to the cloud, enabling a pooling of biometric information which can then be viewed on one software interface by health care providers, caregivers and individuals themselves.

Despite just having being launched, Qualcomm says it already has 40 customers already either integrating or considering the 2net ecosystem.

"Qualcomm Life was founded, in part, to assist medical device manufacturers who approached Qualcomm for help when their own wireless connectivity attempts became untenable due to technology selection errors, unscalable deployment models and prohibitively high operational support costs," said Rick Valencia, vice president and general manager of Qualcomm Life.

Valencia said Qualcomm's services removed a significant burden of technical development for medical device manufacturers, providing integration with mobile carriers quickly and easily.  

The 2net Platform was created with a "continuum of care" ideology, meaning that patient data could be collected from various different cellular-enabled devices, while results would appear collectively on just one easy to decipher interface.


Qualcomm unveils health subsidiary, cloud hub

MCUs, touch solutions to go on display at ATL

Atmel Corp. is the hold its first-ever developer conference in San Jose, Calif. and it is scheduled for three days beginning on September 11, 2012.

Atmel Technology Live (ATL) is planned to provide formal and informal discussions, hands-on workshops and demos.

"Just as San Jose is at the heart of Silicon Valley, Atmel is at the heart of thousands of today's most influential and inspiring electronics devices. Therefore, to celebrate our synergy with the city and the technology community, we are very pleased to be working with the city of San Jose to showcase our solutions that enable our customers to create products that help drive innovation," said Alf-Egil Bogen, co-inventor of the AVR and Chief Marketing Officer, Atmel.

www.atmel.com/microsite/techlive2012/
MCUs, touch solutions to go on display at ATL

Samsung says Austin fab ramped in record time

SAN FRANCISCO—Samsung Electronics Co. Ltd. said Monday (Dec. 5) its subsidiary in Austin, Texas, completed ramp to volume production of its 300-mm fab in record time.

Samsung said the fab, S2, reached its capacity of 40,000 wafer starts in October, within five months after producing its initial silicon wafers.

The S2 line is designed to manufacture devices utilizing Samsung's low-power logic process technology at the 45-nanometer node. Samsung said it established a synchronized global production network between its facilities in Giheung, South Korea, and Austin ahead of schedule.

"Importantly, this achievement enables us to support customer requirements in a timely manner and enhances customer's level of confidence with us as well as our advanced production competitiveness," said Steve Hah, vice president of Samsung Austin Semiconductor and head of the S2 line, in a statement.

After initiating clean room construction for S2 in August 2010, the company completed the qualification of the process in just seven months, Samsung said.To ramp-up capacity to 40,000 wafers per month quickly and most efficiently, equipment installation was done after extensive simulation and technical study to secure uniformity and synchronized operations among equipment, critical to maintaining high yields during the expansion to high volume of any manufacturing operation, Samsung said.

Samsung Austin Semiconductor has grown to more than 2,400 employees in Austin, according to Samsung. The company has invested more than $9 billion in its Austin facilities, which is the largest foreign investment in Texas and one of the largest single foreign investments in the U.S., according to Samsung.
Samsung says Austin fab ramped in record time

Microsemi tips 'private label' FPGA program

SAN FRANCISCO—Chip vendor Microsemi Corp. Monday (Dec. 5) unveiled a private labeling program for its SmartFusion customizable SoCs.

Under the program, devices will be marked with the customer's logo and part number, Microsemi (Aliso Viejo, Calif.) said. Microsemi will program all devices, alleviating the need for customers to build in-house programming capabilities and infrastructure, the company said.

Microsemi's customizable SmartFusion SoCs include a licensed, hard ARM Cortex-M3 processor. Customers don't need to obtain a separate license from ARM, Microsemi said.

"Our new private label program enables companies to rapidly deliver economical and differentiated system-on-chip solutions, which is a key competitive advantage," said Esam Elashmawi, vice president and general manager at Microsemi, in a statement.

According to Microsemi, more than a dozen companies are already using its flash-based, highly flexible architectures to deliver tailored solutions to customers.

Microsemi's SmartFusion customizable SoCs are the only devices that integrate an FPGA, a complete microcontroller built around a hard ARM Cortex-M3 processor and programmable analog.

Microsemi tips 'private label' FPGA program

NXP boosts LPC4300 to 204 MHz, hits the shelves

The 204-MHz, LPC4300 asymmetrical dual-core DSC (digital signal controller) from NXP is now available and is based on the ARM Cortex-M4 processor with a Cortex-M0 co-processor. The performance of the LPC1800 series has also been extended to 180 MHz.

The LPC4300 and LPC1800 have been manufactured using the same ultra-low leakage 90-nm technology, are pin- and software-compatible, and share many features. The LPC4000 family was announced in November 2010 and at that stage the company's roadmap indicated the LPC4300 would be a 150 MHz.

The first LPC4300 part available is the LPC4350 in a BGA256 package, a fleshless part with 264KB SRAM. Flash parts will be available in the first quarter of 2012.

The 204-MHz LPC4300 will be suitable for a range of applications such as embedded audio, high-end motor control, industrial automation, point-of-sale, medical devices, and automotive accessories.

The asymmetrical dual-core architecture has the Cortex-M4 core, optimized for real-time processing, and the Cortex-M0 core, optimized for real-time control. The small gate-count Cortex-M0 has been added to offload many of the control and I/O handling duties that drain the bandwidth of the Cortex-M4 core. Both cores are capable of running at 204 MHz.

Configurable peripherals on the LPC4300 and LPC1800 include the state configurable timer sub-system, which lets designers configure advanced timing operations with state machine control including complex motor-control functions and the quad lane SPI flash interface, which extends the code and data memory map using inexpensive, low-pin count SPI data flash.

Additionally, the LPC4300 has the serial GPIO interface, which is capable of emulating standard interfaces such as multiple I2S for a 7.1 multi-channel audio connection.

Software and development tool support for the LPC4300 and LPC1800 include CMSIS-compliant peripheral driver library; a full-featured open-source USB library and USB ROM drivers supporting its Hi-Speed USB Host/Device/OTG interfaces with on-chip high-speed PHY; and the emWin graphic library from SEGGER free of charge for NXP customers. Dual-core debugging support is provided by ARM development tools including IAR Systems, Keil, and NXP's Eclipse-based LPCXpresso IDE.

The LPC4300 series starts at $3.75 for quantities of 10,000 pieces and suggested pricing for the LPC1800 series starts at $2.95 for quantities of 10,000 pieces. Other packages include TFBGA100, LQFP144, LQFP100, LQFP208, and BGA180.

Watch this video to see NXP applications engineering manager Kenneth Dwyer introduce the concept of Inter-Processor Communication with the LPC4300 demo board.

This story was originally posted by EE Times.

News From EE Times

 


NXP boosts LPC4300 to 204 MHz, hits the shelves

PLX refreshes 40nm 10GBaseT chips

SAN JOSE—PLX Technology announced three new transceivers for 10 Gbit/s Ethernet over copper, cutting die size and cost nearly in half while adding features and shaving half a Watt off power consumption. The TN8000 parts come at a time when the 10GBase-T standard is finally seeing some market traction, more than two years after the standard was ratified.

The single-, dual- and quad-port devices are made in 40-nm technology and support distances of 120 m on Cat 6A cables. The chips provide new low power modes enhancing the Energy Efficient Ethernet standard (IEEE 802.3az). They also support Wake-on-LAN and variable or fixed latency for Media Access Control Security.

PLX has taped-out the chips and will start sampling them in February. Volume prices range from $20 to $40 per port.

The company competes with Broadcom, Marvell and startup Aquantia who also sell physical-layer chips for 10 Gbit/s Ethernet over copper.

PLX claims eight new switches-including ones from Arista Networks—and four motherboards or adapter cards have already designed in 10GBase-T links. Earlier this year, Cisco, Emulex and Hewlett-Packard announced support for 10GBase-T. For its part, Intel has also shown an integrated 10GBase-T transceiver called Twinville.

OEMs did not use the first generations of 10GBase-T transceivers because they consumed too much power. The new PLX chips consume 2.5W when sending data over 30 m and 3.5W when sending over 100 meters.

One market analyst recently forecast sales of 10GBase-T chips will be modest in next-generation servers at about $350 million through 2014. However, 28 nm chips are expected to be widely used on a future generation of server motherboards.

The long road to market adoption caused many 10GBase-T startups to fall prey to acquisitions at relatively low valuations. PLX got its technology when it acquired Teranetics in September 2010 for $36 million.

This story was originally posted by EE Times.

News From EE Times

 


PLX refreshes 40nm 10GBaseT chips

NXP boosts LPC43000 to 204MHz, hits the shelves

The 204 MHz, LPC4300 asymmetrical dual-core digital signal controller (DSC) from NXP is now available and is based on the ARM Cortex-M4 processor with a Cortex-M0 co-processor. The performance of the LPC1800 series has also been extended to 180 MHz.

The LPC4300 and LPC1800 have been manufactured using the same ultra-low leakage 90-nm technology, are pin- and software-compatible, and share many features. The LPC4000 family was announced in November 2010 and at that stage the company's roadmap indicated the LPC4300 would be a 150MHz.
 
The first LPC4300 part available is the LPC4350 in a BGA256 package – a fleshless part with 264KB SRAM. Flash parts will be available in the first quarter of 2012.

The 204 MHz LPC4300  will be suitable for a range of applications such as embedded audio, high-end motor control, industrial automation, point-of-sale, medical devices, and automotive accessories.

The asymmetrical dual-core architecture has the Cortex-M4 core, optimized for real-time processing, and the Cortex-M0 core, optimized for real-time control. The small gate-count Cortex-M0 has been added to offload many of the control and I/O handling duties that drain the bandwidth of the Cortex-M4 core. Both cores are capable of running at 204 MHz.

Configurable peripherals on the LPC4300 and LPC1800 include the state configurable timer sub-system, which lets designers configure advanced timing operations with state machine control including complex motor-control functions and the quad lane SPI flash interface, which extends the code and data memory map using inexpensive, low-pin count SPI data flash.

Additionally, the LPC4300 has the serial GPIO interface, which is capable of emulating standard interfaces such as multiple I2S for a 7.1 multi-channel audio connection.

Software and development tool support for the LPC4300 and LPC1800 include CMSIS-compliant peripheral driver library; a full-featured open-source USB library and USB ROM drivers supporting its Hi-Speed USB Host/Device/OTG interfaces with on-chip high-speed PHY; and the emWin graphic library from SEGGER free of charge for NXP customers. Dual-core debugging support is provided by ARM development tools including IAR Systems, Keil, and NXP's Eclipse-based LPCXpresso IDE.

The LPC4300 series starts at $3.75 for quantities of 10,000 pieces and suggested pricing for the LPC1800 series starts at $2.95 for quantities of 10,000 pieces. Other packages include TFBGA100, LQFP144, LQFP100, LQFP208, and BGA180.

The video below shows NXP applications engineering manager Kenneth Dwyer introducing the concept of Inter-Processor Communication with the LPC4300 demo board.

NXP boosts LPC43000 to 204MHz, hits the shelves

Tessera says Micron didn't renew license deal

SAN FRANCISCO—Memory chip vendor Micron Technology Inc. declined to exercise a renewal option on a 2006 technology license agreement with Tessera Technologies Inc., Tessera said Monday (Dec. 5).

Tessera (San Jose, Calif.) said it will not comment on ongoing discussions with Micron or other customers. Micron (Boise, Idaho) agreed in July 2006 to license for $30 million Tessera's compliant chip technology for semiconductor packaging.

Tessera said Monday that it expects fourth quarter sales to decline to $56.5 million, down 5 percent from the third quarter and down 30 percent from the fourth quarter of 2010.

Tessera said it expects revenue from its microelectronics subsidiary, Tessera Inc., to decline to $48.5 million in the fourth quarter, down 4 percent from the previous quarter and down 32 percent from the fourth quarter of 2010.

Tessera says Micron didn't renew license deal

Heliatek achieves 9.8 percent organic solar cell efficiency

MANHASSET, NY -- Heliatek GmbH has achieved an organic solar cell efficiency of 9.8 percent for a 1.1 cm² tandem cell manufactured with a low-temperature deposition process.

The purported world record certified by independent Fraunhofer ISE CalLab makes the third time in a row that Heliatek has set a world record for efficiency in the field of organic photovoltaic, according to the company.

Earlier, Heliatek achieved 8.3 percent efficiency for an active surface of 1.1 cm².
 
"Heliatek is the only solar company in the world focused on the deposition of small molecules with low temperature processes, a method that has already been widely adopted by the market for use with organic LEDs (OLEDs). Organic solar cells from Heliatek have now reached the level of efficiency of conventional solar cells made from amorphous silicon," said Martin Pfeiffer, co-founder and CTO of Heliatek, in a statement.
 
The new cell construction will gradually be integrated into Heliatek's manufacturing process in the second half of 2012. Heliatek's in-house measurements have shown that scaling up the cells to a panel with a size factor >120 results in an efficiency over 9 percent for the active module area.

"The next step will be a cell with over 10 percent efficiency sometime next year," said Thibaud Le Séguillon, CEO of Heliatek.

Heliatek was spun off in 2006 from the Technical University of Dresden (IAPP) and the University of Ulm.
Heliatek achieves 9.8 percent organic solar cell efficiency

2011-12-05

EDA standards bodies Accellera, OSCI merge

SAN FRANCISCO—As expected, EDA and intellectual property (IP) standards development organizations Accellera and the Open SystemC Initiative (OSCI) said Monday (Dec. 5) their members and boards have approved their merger.

The merged entity, to be known as the Accellera Systems Initiative, is chartered to create comprehensive system-level and semiconductor design standards to benefit the electronic design community by facilitating efficient collaboration among its worldwide members, the organizations said in a statement.

In June, Accellera and OSCI announced they had signed a memorandum of understanding to form a single organization that would leverage the complementary EDA standards efforts of both groups.

Shishpal Rawat, Accellera's chair, said overlapping member companies and aims made both organizations feel that the merger was the right course of action. Rawat said he will remain chair of the merged entity until previously scheduled elections are held in two months. The board of the merged entity will be expanded to encompass the board members from both organizations, he said. "It didn't make sense to choose new officers for two months," he said.

Rawat said the next step is to review the work of the technical committees of each organization and prepare for merging those. But for now, he said, committees will continue to operate as they had been. "The committees in each organiztion had certain work in progress," Rawat said. "We would like to see that work completed."

"As Accellera and OSCI come together, we should expect accelerated development and adoption of standards across various ESL domains," said Gary Smith, chief analyst at Gary Smith EDA.

Last year, Accellera merged with The Spirit Consortium.


EDA standards bodies Accellera, OSCI merge

PLX refreshes 40nm 10GBase-T chips

SAN JOSE -- PLX Technology announced three new transceivers for 10 Gbit/s Ethernet over copper, cutting die size and cost nearly in half while adding features and shaving half a Watt off power consumption. The TN8000 parts come at a time when the 10GBase-T standard is finally seeing some market traction, more than two years after the standard was ratified.

The single-, dual- and quad-port devices are made in 40 nm technology and support distances of 120 meters on Cat 6A cables. The chips provide new low power modes enhancing the Energy Efficient Ethernet standard (IEEE 802.3az). They also support Wake-on-LAN and variable or fixed latency for Media Access Control Security.

PLX has taped-out the chips and will start sampling them in February. Volume prices range from $20 to $40 per port.

The company competes with Broadcom, Marvell and startup Aquantia who also sell physical-layer chips for 10 Gbit/s Ethernet over copper.

PLX claims eight new switches—including ones from Arista Networks--and four motherboards or adapter cards have already designed in 10GBase-T links. Earlier this year, Cisco, Emulex and Hewlett-Packard announced support for 10GBase-T. For its part, Intel has also shown an integrated 10GBase-T transceiver called Twinville.

OEMs did not use the first generations of 10GBase-T transceivers because they consumed too much power. The new PLX chips consume 2.5W when sending data over 30 meters and 3.5W when sending over 100 meters.

One market analyst recently forecast sales of 10GBase-T chips will be modest in next-generation servers at about $350 million through 2014. However, 28 nm chips are expected to be widely used on a future generation of server motherboards.

The long road to market adoption caused many 10GBase-T startups to fall prey to acquisitions at relatively low valuations. PLX got its technology when it acquired Teranetics in September 2010 for $36 million.


PLX refreshes 40nm 10GBase-T chips

VC history seen with rose-colored glasses

SAN JOSE, Calif. – Thanks to Eastwick PR for inviting me to a private screening of the new documentary "Something Ventured." I highly recommend it as an important piece of the history of the electronics industry--seen through somewhat rose-colored glasses.

The film tells the humorous and very human stories of a handful of veteran Silicon Valley venture capitalists, but it underplays the shadow side of this world that's also well known here in Silicon Valley. It's wonderfully entertaining and informative, but it doesn't really open up this sector of our industry to as much critical analysis as it deserves.

Missing from the film is a hard look at Silicon Valley's over-work ethic that venture-funded startups drive. Startups are notorious for striking with employees a questionable bargain of the promise of possible riches in return for the certainty of dedicating four or five years of their lives to creating a new company.

Of course in nine out of ten cases the riches never materialize for anyone but perhaps the founders. In the majority of cases even the founders may not reap what they could have had with top jobs at established companies.

There's a reason that people joke VC stands for vulture capitalists. It's the same reason some entrepreneurs do back flips for financing rather than take VC money. The cash gets doled out in denominations of millions from guys that expect returns at least in tens of millions—and seeing that billion-dollar IPO or acquisition light flashing is what really makes them happy.

Face it, Sand Hill Road is to some extent the West Coast equivalent of Wall Street. Gordon Gekko's dictum that "Greed is Good" is the unspoken gospel. World-class universities such as Stanford are marinated in this philosophy with the VC offices that surround the campus.

As evidence, you will hear many times in the movie the big VCs talking about the importance of really, really big markets. That's what seems to put a glint in the eyes of veterans like Tom Perkins, interviewed for the movie on his beyond-massive custom yacht, the Maltese Falcon.

Don't get me wrong, VCs have done great things. They helped bring us the microprocessor, PC, Internet and even biotech by funding companies such as Intel, Apple, Cisco and Genentech.

The stories of these companies are at the heart of the film. As the movie points out people like Arthur Rock virtually invented the VC model and the concept of equity sharing among startup employees to finance these companies.

However, I would note there is often a huge gulf between the stakeholder status of a handful of founders, the inner circle around them and the rest of the jolt-cola drinking engineers who crank out more than their fair share of the work for often a relatively small slice of the stock. The movie didn't explore that infamous facet of startups either.

It doesn't surprise me that the film was a project started by a Silicon Valley VC and a PR person. Indeed, the National Venture Capital Association could buy rights to show the film as part of its marketing and lobbying efforts.

The film makes a show of exploring the underside of the VC world by telling the story of Sandy Lerner, the female co-founder of Cisco, ultimately booted out of the company. We are told the startup world is a tough place where entrepreneurs are often shoved out of the way as startups morph into growing corporations. The film makers imply Lerner might have been the next Steve Jobs were it not for the conservative gender values of the time.

It's an interesting story, and one I did not know. Indeed, one of the film's producers said they were the first to get an interview with Lerner on the subject of her firing, something that is clearly still painful for her many years after the fact.

Lerner's story while fascinating is a substitute for the real shadow side of the VC world. But that's a story another documentary will have tell, one not backed by a Silicon Valley VC.

Just one aside, Nolan Bushnell, the founder of Atari and one of the entrepreneurs profiled in the film, was on hand for a panel discussion after the movie. The man who helped launch the videogame industry was articulate and candid.

Asked about the road ahead, he noted venture capital has become a big business with lots of money and more formalized procedures these days. And there's no shortage of opportunities, he added.

"There are so many things that need to be done," Bushnell said. His recommendation to the new entrepreneur: "Study world problems and read science fiction."


VC history seen with rose-colored glasses

Agilent boosts device modelling and design portfolio with Beijing acquisition Electronics News

AGILENT is acquiring Accelicon Technologies, a Beijing-based company which provides device-level modelling and validation software for the electronics industry.

The transaction is expected to be completed in 60 to 90 days.

According to Agilent, the acquisition will enhance its leadership in semiconductor device modelling.

Today’s electronics research and development design cycles require accurate and verified device models in order to cope with tighter timelines, smaller technology nodes, new materials, fabrication constraints and more demanding device layouts.

As a result, device modelling continues to be one of the most critical parts of the electronics design flow.

Agilent says the acquisition of Accelicon’s technology and team will allow it to offer a broader portfolio of modelling solutions. It will be able to offer solutions covering the range of R&D capabilities from device modelling to simulation and measurement.

Accelicon sells the SPICE model analysis solution for model quality assurance. Accelicon's MQA solution offers the industry's first model verification platform and provides a critical link between fab and design, comparing, documenting and validating foundry-supplied models.


Agilent boosts device modelling and design portfolio with Beijing acquisition Electronics News

Intel extends semiconductor lead for 2011 Electronics News

INTEL will take back the semiconductor crown decisively in 2011, according IHS iSuppli, with a 15.9 percent share of the market, up from 13.2 percent in 2010.

Aggressive competition within the sector, particularly from Samsung Electronics, meant Intel lost its lead over a number of years. However, Intel has had strong sales and made a number of strategic acquisitions which boosted its position.

The 2011 figures indicate Intel will sell $49.7 billion worth of semiconductors in 2011, a 23 percent rise from 2010’s $40.4 billion.

Intel now leads Samsung by 6.5 percentage points. In 2010, that difference was 3.9 percentage points.

Intel expanded its core microprocessor and memory businesses, deriving most of its revenue from microprocessor units and NAND flash memory, which were big segments of growth for the industry in 2011.

It also acquired Infineon Technologies’ wireless solutions business.

In contrast, while Samsung is also riding on the NAND wave, it was vulnerable to the weakness of the DRAM market, a sector that declined by 27 percent in 2011.

A more detailed report from IHS iSuppli is available here.


Intel extends semiconductor lead for 2011 Electronics News

Bright future for ultra low power RF Electronics News

Ultra low power (ULP) wireless applications are set to increase dramatically. According to analysts ABI Research, for example, the wireless sensor network (WSN) chips market grew by 300 percent in 2010. And the same company forecasts that no less than 467 million healthcare and personal fitness devices using ULP chips will ship in 2016.

But what are these chips and how do they operate? Let’s take a closer look.

Low duty cycle, low power consumption

Unlike other wireless technologies like Wi-Fi and Bluetooth wireless technology, ULP transceivers are designed to run from batteries of modest capacity such as coin cells (for example, the CR2032 or CR2025 type).

Typical applications are based on compact sensors, for example a heart rate monitor (HRM). To track pulse and display the information on a wristwatch only requires the transceiver in the HRM to send small quantities of data (typically a few bits) infrequently (i.e. once every few seconds to a few times per second at most). Duty cycles of 0.25 percent are common with the transceiver spending much of the time in a low energy consumption sleep state.

The duty cycle is minimised because the transceiver wakes up quickly, sends a relatively high-bandwidth “burst” of data (at a rate of up to 1 or 2 Mbps), before immediately returning to sleep.

The combination of very low duty cycle and the incredible efficiency of today’s silicon radios is the secret behind the technology’s ULP performance.

During the short period of activity, the transceivers operate at peak currents of just tens of milliamps. Nordic Semiconductor’s nRF24LE1 2.4GHz transceiver, for example, features a peak transmission current of 11.1mA (at 0dBm output power) and peak receive current of 13.3mA (at 2Mbps). Thereafter the chip returns to sleep state, drawing just a nanoamps. Because transmit/receive time is so short, the average current consumption over the long term is just tens of microamps.

Diverse applications

The sheer diversity of potential applications for ULP wireless technology is remarkable. It has already made inroads into the sports, health, entertainment, PC peripherals, remote control, gaming, mobile phone accessories, home automation and industrial control sectors, and will spread to many others in the coming years.

In simple terms, wireless connectivity requires a radio, software code to control communication (“protocol”) and an application processor (with its own code, that supervises the specific application). How these elements are implemented affects the efficiency, size and cost of the wireless system.

Until recently, the sector was dominated by proprietary solutions (i.e. one that uses technology owned by a single company) primarily because the semiconductor vendors were able to optimise the silicon and protocol without the encumbrance of the additional overhead required for the assured interoperability typical of a standards-based solution

The result was a more efficient solution with lower power consumption and reduced cost – the two critical factors for companies searching for the best ULP wireless solution. So-called “ultra-low power” wireless technologies such as ZigBee, while offering impressive performance, couldn’t compete with the power consumption of the best of the proprietary offerings.

Figure 1: The nRF24LU1+ allows PC peripheral manufacturers to make tiny USB dongles with a physical profile that hardly extends beyond the USB port of the host computer

Nordic, for example, has had good success supplying its proprietary nRF24LE1 to the wireless desktop peripherals market (mice and keyboards). The nRF24LE1 comprises a 2.4GHz ULP transceiver, Gazell™ protocol in flash or one time programmable (OTP) memory and an enhanced 8-bit microcontroller all on a single chip. This chip measures just 5 by 5mm - allowing it to fit into even the smallest of wireless mice designs.

The other end of the link is completed by an nRF24LU1+ which allows PC peripheral manufacturers to make tiny USB dongles whose physical profile hardly extends beyond the USB port of the host computer. (See figure 1.)

The demand for interoperability

As ULP wireless has diversified into more applications, the lack of interoperability has started to become a problem for some OEMs. The success of Bluetooth wireless technology has demonstrated the huge benefits of establishing a wireless “ecosystem” where products from different manufacturers can seamlessly connect.

Nordic and its design partner ANT Wireless of Cochrane, Canada, have addressed the interoperability demand to a certain extent with a combination of Nordic’s radio expertise and ANT’s ANT+ software and managed network product.

Running on Nordic’s nRF24AP2 – integrating a 2.4GHz ULP transceiver, ANT wireless protocol and high-quality microcontroller/processor interface in a single chip - ANT+ technology is supervised by an alliance of nearly 400 companies and has been adopted as a de facto standard by manufacturers such as Garmin and Trek in the cycling sector. (In fact, many of the riders in the 2011 Tour de France used wireless performance sensors linked to bike computers powered by Nordic chips and ANT software.)

And, recently, in addition to Nordic Semiconductor, another semiconductor company has started to offer ANT chips offering customers a multi-vendor environment.  

However, the Holy Grail for interoperable ULP wireless technology promoters is to emulate the success that Bluetooth wireless technology has had in the low power RF sector.

Extending Bluetooth

That ambition is now set to become reality because the custodian of Bluetooth wireless technology, the Bluetooth Special Interest Group (SIG), has now ratified a version that can operate from coin cell batteries. So-called Bluetooth low energy (a hallmark feature of the latest release of Bluetooth wireless technology, Version 4.0) has been designed to allow sensors and other peripherals devices to communicate with each other and products such as the next generation of mobile phones.

Figures 2a and b: Nordic’s µBlue nRF8001 is the company’s Bluetooth low energy chip and has been selected by Casio for its G-SHOCK Bluetooth low energy watch

Semiconductor vendors are now shipping Bluetooth low energy chips. For its part, Nordic – which played a significant role in the development of the specification, donating its extensive ULP wireless design heritage to the technology – has released the first in its µBlue™ Series of Bluetooth low energy chips.

The nRF8001 is a complete Bluetooth low energy solution in a 32-pin 5 by 5mm QFN package incorporating a fully embedded radio, link controller, and host subsystem. The chip is suitable for watches, sensors and remote controls among other applications. Casio’s recently released G-SHOCK Bluetooth Low Energy Watch uses this chip. (See Figures 2a and b.)

The Bluetooth SIG’s stated intention is to release Profiles for Bluetooth low energy, including Personal User Interface Devices (PUID) (such as watches), Remote Control, Proximity Alarm, Battery Status and Heart Rate, in the next several months. Other health and fitness monitoring profiles such as blood-glucose and -pressure, cycle cadence and cycle crank power will follow.

Bluetooth v4.0 chips are also becoming available. Devices such as mobile phones should start to incorporate these chips - as a replacement for the current generation of Bluetooth wireless technology -in the second half of 2011. Once that happens, the full potential of this exciting new technology will start to be realised because the ULP wireless-powered devices will be able to link directly with the huge Bluetooth ecosystem.  

As Nordic Semiconductor’s CEO, Svenn-Tore Larsen, puts it: “Once designers have an inexpensive way to add an interoperable wireless link to anything that’s battery powered, even devices with the smallest batteries, the application potential is vast. Designers will come up with thousands of ways to use that link.”

Further information: Kjartan Furset is based in Hong Kong and is a Senior Applications Engineer with Nordic Semiconductor. The company is a leader in ULP wireless connectivity in the 2.4GHz Industrial, Scientific and Medical (ISM) band. For more information on Nordic products please visit www.nordicsemi.com.


Bright future for ultra low power RF Electronics News

Waterproof cochlear sound processors Electronics News

COCHLEAR implants and sound processors that are waterproof are now a reality for US and Canadian users.

Advanced Bionics has received US and Canadian approval for its Neptune swimmable and waterproof sound processor.

The Neptune unit helps cochlear implant recipients hear in and out of the water. This means they can listen to important safety instructions and other such language development opportunities during swimming or bathing.

The waterproof design of the Neptune also allows it to be used in a wider range of terrains, and it can be worn anywhere, such as in the hair, on an arm, under a collar, in a pocket.


Waterproof cochlear sound processors Electronics News

QA with Doug Ford, electronics designer Electronics News

Doug Ford is the owner and principal engineer of Doug Ford Analog Design, which he founded in 2008 as an electronic design consultancy.

 

How did you get started in electronics?

I started as a hobbyist. Back in those days, it was valves. Everyone was tossing out their old black and white valve TVs and buying colour TVs, so I'd grab them and strip the components out, and make guitar amplifiers and valve transmitters.

I then discovered transistors and the fact that you could do things with transistors rather similar to valves, and from a hobby, it grew into a profession.

I got an electrical engineering degree in university. My first major job was with Jands Electronics. I actually started with them prior to completing my degree, but as a bench technician.

Once I finished my degree, I was offered a role there as design engineer. I was with Jands for a total of around 19 years. That was back in the days when once you got a job, you figured that a job was pretty much there for life.

In the early days of Jands, they were manufacturing everything that you needed to put on a rock show. We are talking about power amplifiers, mixing consoles, lighting control consoles, lighting dimmers, high power PA speakers and signal processing gear.

Over a period of time, their product field narrowed until these days they are primarily manufacturing lighting control consoles. And I think they manufactured dimmers simply to support the consoles. Back in 1999-2000 I was getting pretty bored of designing dimmers all day.

So I went to RODE Microphones, where I was for about 18 months, and did some frankly, really good work there, designing very low noise microphone pre-amplifiers for their new range of mics. In fact to my best of my knowledge, to this day they are still using the topologies I developed during that time.

There was a conflict of personalities, so I went to Newcastle and worked for a family business called Woods Battery Chargers, designing industrial battery chargers.

Eighteen months, then back down to Sydney, to Thales Underwater Systems, designing sonar systems.for defense and seismic sonar systems for oil prospecting.

I was basically sold off, with part of that company to another French company called Sercel, who set up shop in the same building as Thales. Sercel took over the seismic sonar part of things, leaving Thales to concentrate on the military.

Sercel went belly-up in about '96-'97. That was when I went to Addcom, who were designing telephony headsets for call centres, and worked there for 20 months, before starting my own business.

How did you get into your current job?

It was about three and a half years ago that I figured it was time to strike out on my own. I set up Doug Ford Analogue Design. Initially, I got pretty good start-up money, because I was sub-contracting, doing a defence project.

That lasted for about 6 or 8 months. Then the company I was sub-contracting for went belly-up, owing me $27,000. But I survived that and survived the GFC.

What is your specialty?

I guess I am still across quite a diverse range of technology and industries, all of which require analogue expertise.

We're talking about anything related to power conversion, and also amplification, such as low-noise pre-amps for studio mics, it might be front-ends for sonar systems, a variety of different signal processing applications, and sometimes you mix the two together.

Sometimes you can combine all of those with a degree of thermal management expertise, and all of a sudden you realise you are in a good place to do some high brightness LED work.

What do you enjoy about your role?

I think that anybody who goes into business for themselves enjoys being their own boss, but that's actually a relatively trivial side of it.

What I most enjoy is firstly the range of different jobs, the different industries I can work with.

Secondly, there's always a real buzz that comes when you see something that you've worked on go into production and get used by people.

What challenges you?

I was bought up in a family that was not in business. A lot of families eat, drink and understand business right from the word go. They are picking up tax law with their mother's milk. Not so for me. I had to learn all the various business skills that were required in terms of administration, finance, all that sort of thing. I am still learning. That's a big challenge.

The second challenge relates to how do I go about marketing myself. How do I let my company name be known to people who need it. I am still frankly clueless in as far as that's concerned.

How has the industry changed?

In the 70s and 80s, you could expect an Australian manufacturer to pretty much have all of the technologies required to manufacture their product under one roof.

Things went pretty moribund in the 80s, and started reviving in the 90s, but now each company has its own particular skill set.

There's a lot more cross-fertilisation because the industries are somewhat more specialised now.

What problems face the electronics industry?

There is a hangover from the GFC, which might take a little while to fade.

Things change. Competitors pop up, new technologies can easily displace somebody's existing multi-hundred-million dollar industry with something that costs a tuppence that you can hold in your hand.

More and more often we are getting disruptive technologies. I think a degree of agility is required.

What advice do you have to give to younger engineers?

Don't leap from university into starting a business, unless you have a family background in business, and a whole lot of start-up money.

See if you can give yourself maybe somewhere between half a dozen and a dozen years of working for a few companies, so that you can learn the engineering methodologies from each one.

It behoves anybody to get a pretty wide cross-section - the more experience you can get, the better you'll be as an engineer. This applies whether you are talking about design engineers or QA type engineers.


QA with Doug Ford, electronics designer Electronics News

Report: Taiwan to offer consumer spending incentive



LONDON – Throughout the first quarter of 2012 the Taiwan government plans to provide its citizens with subsidies for the replacement of old air conditioners, refrigerators and washing machines, according to a Taiwan Economic News report.

The government will provide NT$2,000 (about $66) for each old item replaced with an energy-saving model, the report said.

The program is intended to help Taiwan cope with knock-on effects from the European debt crisis in 2012 and bolster the local economy. The subsidy only applies to the purchase of Taiwan-made products for the replacement of old machines.

The plan is expected to have a triple benefit; saving national energy consumption, stimulating the local economy and stimulating the local development of consumer goods, the report quoted Jerry Ou, director general of the Bureau of Energy, under the Ministry of Economic Affairs (MOEA), as saying.

The program has a total budget of NT$600 million ($20 million) but it is expected to prompt the purchase of 300,000 Taiwan made units and NT$7.9 billion (about $260 million) of consumption, the report said.

LCD TV could be the subject of another subsidy later in 2012 timed to coincide with the introduction of digital TV broadcasts in Taiwan in July, the report added.

Similar spending incentives were provided for the automobile trade-ins in several countries in response to the global economic crisis of 2008-2009.

Air conditioners and refrigerators account for 45 and 11 percent of domestic power consumption, respectively, the report said.


Report: Taiwan to offer consumer spending incentive

October global chip sales fell back, says WSTS


LONDON – Actual global chip sales in October, rather than the three month average, were $23.41 billion down 20.5 percent from the preceding month and down 4.1 percent on the $24.40 billion recorded for October 2010, according to figures published by the World Semiconductor Trade Statistics (WSTS).

The sales came in below a range predicted by market analyst Mike Cowan and indicate the chip industry is likely to achieve meager or zero growth for the full year after starting with strong annual growth in the first quarter of the year. They are also likely to be seen as a disappointment after a relatively strong September, ended the third quarter.

WSTS also published the three-month average sales data which attributes the average of August, September and October sales to October. This is promulgated by the Semiconductor Industry Association in the United States and other regional semiconductor industry bodies because it smoothes out the actual data that usually show troughs at the beginnings of the quarters and peaks at the ends of the quarters.

The three-month-average of global chip sales for October is $25.74 billion, flat with the $25.76 billion recorded for September and also behind the equivalent figure for October 2010 of $26.20 billion.

However, when considering the actual data in comparison with previous years it can be seen that a sequential fall in chip sales in October of about 20.5 percent is close to the ten-year average of 18.3 percent Indeed, in the previous ten years in five years the October sales fall was greater than this and in five years it was less.

On a geographic basis the actual chip sales data shows that all the regions experienced sharp sequential falls in chip sales, as would be expected.

The Asia-Pacific region, which now represents more than half of global chip sales, and Europe did worse than the global average falling back by 22.0 to $12.58 billion and 22.3 percent to $2.79 billion respectively. The Americas region declined in line with the global market by 18.7 percent to $4.38 billion. The Japanese market declined by the least, by 15.4 percent to $3.69 billion.

The year-to-date global chip sales for January through October 2011 stands at $251.28 billion, compared with $247.26 billion for the equivalent period in 2010, according to the WSTS data.

Taking the latest WSTS data into account Cowan is forecasting 2011 with see global chip sales of $304.71 billion, an increase of 2.1 percent on 2010 and that 2012 will see annual growth of 7.3 percent to take the market to $326.86 billion.


Related links and articles:

www.wsts.org

News articles:


Analysis: Strong September boosts 2011 IC forecast Paid

Updated: Global chip sales show September growth


SIA restates Q3 comparisons after statistics glitch


August chip sales show surprise growth

Japan up, RoW down in flat July chip sales


October global chip sales fell back, says WSTS

2011-12-04

Biometrics for Cambridge exams and student visa applications Electronics News

BIOMETRICS will be used to verify the identity of candidates taking part in the advanced English tests, which are required for Australian student visa applications.

Aware will be providing the biometric solution to Cambridge Assessment, the international exams group for the University of Cambridge.

Cambridge Assessment provides academic exams for a range of countries, and also administers exams run by the Australian Department of Immigration and Citizenship (DIAC) for student visa applications.

The biometric solution is based on Aware’s COTS Biometric Services Platform (BioSP). Also to be provided are user interface development services.

The solution will form the basis of Identica, which is part of Cambridge Assessment's exam fraud prevention services.

The Identica system enables exam proctors to easily capture ISO-compliant facial images of candidates upon their arrival at the test centre. These images are then made available to organisations wishing to verify that the candidate presenting a certificate is the candidate who took the test.

The system can be easily upgraded to support additional biometric modalities, including fingerprints.

University of Cambridge ESOL Examinations will be the first to use Identica for its CAE (Cambridge English: Advanced) test, which is now recognized by the Australian Department of Immigration and Citizenship (DIAC) for student visa applications.

The service has been rolled out to Cambridge ESOL test centers globally, and is expected to be in use in over 130 countries by the end of 2011.

Aware will participate as the Platinum Sponsor of the Biometrics Institute Technology Showcase and Exhibition, taking place in Canberra, Australia on November 30, 2011. Aware will be demonstrating BioSP and other biometrics software products in their stand at the event.


Biometrics for Cambridge exams and student visa applications Electronics News

iSonea to commercialise asthma monitoring devices Electronics News

ISONEA says it is focusing on the commercialisation of its over-the-counter asthma monitoring devices which will work with mobile health apps.

iSonea is the joint effort of Israel-based iSonea and Australian company Pulmosonix. It is developing Acoustic Respiratory Monitoring (ARM) medical devices, and these have been approved by the US FDA, Australian TGA and the European Union CE.

According to iSonea, its technology addresses an enormous un-met medical need for frequent asthma monitoring.

In mid-November 2011, iSonea announced a $4.3 million rights issue on the Australian stock exchange to fund its plans to commercialise its products in the US, Australia and other international markets.

It is also developing over-the-counter asthma monitoring devices with mobile health capabilities, using iSonea core technology coupled with internet and social media marketing campaigns.

iSonea hopes its strategy will lower production costs and increase sales and distribution capacity.


iSonea to commercialise asthma monitoring devices Electronics News

Next generation IBM supercomputer to deploy 2012 Electronics News

IBM has announced the Blue Gene/Q next generation supercomputing project, for full deployment in 2012.

The Blue Gene/Q-based Sequoia system will be installed at the Lawrence Livermore National Laboratory, and is expected to achieve 20 petaflops at peak performance, making it one of the fastest supercomputers in the world.

The high performance computing (HPC) will allow engineers and scientists to solve very challenging problems faster and more reliably.

Blue Gene/Q is also expected to become the world’s most power-efficient computer, churning out 2 gigaflops per watt.  

The third generation in the Blue Gene family of supercomputers, Blue Gene/Q operates at an order of magnitude faster than previous systems, deploying 16 multi-processing core technology and a scalable peak performance up to 100 petaflops.

Applicable to a growing set of computationally intensive workloads within the scientific community, Blue Gene/Q is the ideal platform for highly complex projects in a broad range of areas from nuclear energy to climate modeling.  

Designed with a small footprint and low power requirements, Blue Gene/Q was ranked as the number-one most energy-efficient supercomputer in the world by the Green500.

It provides low latency, high performance runs that simplify tracing errors and tuning performance, all based on an open source and standards-based operating environment.


Next generation IBM supercomputer to deploy 2012 Electronics News

Panasonic to read brain waves to automatically tune hearing aids Electronics News

PANASONIC is now developing a new technology for fitting hearing aids, using brain waves to automatically adjust sound levels.

The Panasonic development will estimate the loudest level of sound the user can comfortably tolerate, by interpreting the electro electroencephalogram (EEG) brain wave patterns recorded during a sound test.

This will reduce the strain on users and the time required to fit hearing aids.

Panasonic started clinical evaluation of this method in cooperation with the University of Fukui, with an aim to put it into practice as an automatic volume level fitting system for hearing aids in 2015.

The perception of loudness differs from person to person and the acceptable sound volume limit depends on each person. Hearing aids must be tuned to meet these needs.

The maximum sound volume is an important key factor for hearing aid fitting. The conventional method for adjusting volumes in the hearing aid fitting process uses the minimum volume hearing threshold level to calculate the maximum sound level.

Traditionally, the process has been one of trial-and-error, requiring users to go through a loudness test. This was stressful and not very accurate.

Using the new method, the maximum volume level for each user can be estimated objectively based on the EEG response to auditory stimuli, normal volume sound, in a short time and with a high degree of accuracy (a margin of error: +/-5 dB).


Panasonic to read brain waves to automatically tune hearing aids Electronics News

Counterfeit Elpida DRAMs actually Samsung chips Electronics News

DICK James wrote on the Chipworks blog about his investigation into counterfeit Elpida DRAM products, and found counterfeiters were rebadging low-grade Samsung components.

Elpida has an announcement on its site concerning counterfeit products, warning that some DRAMs marked as Elpida were fakes and had performance and quality problems.

James said that as a customer, he was affected, since what he thought were genuine 2Gb Elpida 25-nm DDR3 SDRAMs were in fact counterfeits.

The package was marked with genuine-looking parts numbers, but further investigation found a Samsung 2Gb die, along with the associated die mark. Additionally, the Samsung component used the 48nm process, not the 25nm process that the Elpida product allegedly has.

James said the counterfeiters removed the markings on low-grade Samsung parts, then re-marked them with high-end Elpida numbers. However, given the current prices for memory, little profit can be made from such actions.

For more information and a more detailed dissection, visit the Chipworks blog.


Counterfeit Elpida DRAMs actually Samsung chips Electronics News

RFID inventor passes away Electronics News

INVENTOR of radio frequency identification (RFID) wireless technology Charlie Walton has passed away, aged 89.

RFID is now widely used to provide secure access, tracking, payment and limited data exchange. But few of its users are aware of the work of Walton.

The technology was solely invented by Walton in the 1970s, with patents filed 1973 and 1983, but only really came into widespread use in the 2000s, as technology matured which allowed the chips to be manufactured cost-effectively.

RFID gave Walton a windfall of a few million dollars, and he continued inventing technology until his death in November 2011.

RFID transmit information via short-range radio waves, and make use of a database located on a computer to function. Its main competition has been the cheap barcodes which are still prevalent today,

Walton’s form of RFID uses a tiny electrical current from the RFID reader, to wake up the tag and provide it with enough power to generate a response, simply by establishing a wireless connection with it.

The first passive RFID key was bulky, but the technology has since miniaturised. In 1980, Walton patented a digital version which can change the data on the tags.

While Walton made quite a bit of money from royalties, his patents expired before the large wave of RFID adoption.


RFID inventor passes away Electronics News

New atomic-level treatment optimises chip interconnects Electronics News

APPLIED Materials says its new

Applied Producer Onyx film treatment system

can reduce power consumption in semiconductor chips.

The system optimises the molecular structure of the low k films that insulate the interconnects on each chip, allowing faster and more power-efficient logic devices to be fabricated as they scale to 22nm and below.

According to Applied Materials, the interconnect represents approximately one-third of the total power consumed by a chip. Targeting this makes sense in an approach to achieve higher performance and longer battery life in advanced logic devices.

With each successive technology node, interconnect wires get closer to one another, increasing the potential for parasitic capacitance, or crosstalk, between adjacent lines. This restricts switching speed and wastes power.

Reducing capacitance, by lowering the k-value of the insulating material that separates and supports these structures, is a key component in ensuring continued improvement in performance and battery life.

The company says the Onyx system drives carbon and silicon into the porous dielectric film to reinforce the insulating material at the atomic level.

It delivers the most power-efficient interconnects in the industry, while increasing mechanical strength, making the chip robust to better withstand the challenge of emerging 3D packaging applications.


New atomic-level treatment optimises chip interconnects Electronics News

Toshiba shuts three semiconductor facilities Electronics News

TOSHIBA will shut three of its semiconductor factories in Japan in the face of falling profits.

The reduced demand for electronics goods in the current economic climate means Toshiba will also ramp down production rate at a number of its facilities.

“The reorganisation will concentrate the front- and back-end production processes of six discrete semiconductor facilities into three major facilities: Hijimeji Operations-Semiconductor (Ibo-gun, Hyogo prefecture); Kaga Toshiba Electronics Corporation (Nomi, Ishikawa prefecture); and Buzen Toshiba Electronics Corporation (Buzen, Fukuoka prefecture),” Toshiba stated in its press release.

In October, Toshiba announced its net profit for the six months to September. This dropped 18.5 percent compared to the previous period due to the strong yen and repercussions of the 11 March 2011 earthquake and tsunami catastrophe.

Toshiba will be reducing production of its six-inch wafers, while boosting eight-inch wafers.

More information.


Toshiba shuts three semiconductor facilities Electronics News

Building started on MWA radio telescope Electronics News

BUILDING has started on the Murchison Wide-field Array (MWA) radio telescope in Western Australia, with local industry constructing the first major pieces.

The MWA is one of three Square Kilometre Array (SKA) precursors which will prove the technology n the path to the SKA.

Curtin University leads the Australian contribution to the $30 million project, which is being built by a consortium of around 13 institutions over four countries (Australia, USA, India and New Zealand).

Fremantle-based Poseidon Scientific Instruments (PSI) has been awarded a $1.3 million by Curtin to build receivers for the system. The complicated electronics of the receivers will be housed in weather-tight enclosures measuring 2m x 2m x 1m.

In addition to building the electronics, PSI has also developed an enclosure which is shielded from radio frequency interference.

PSI have built prototypes and now has the contract to produce the final system of 16 receivers.

The instrument will consist of 128 antennas connected to the 16 receivers in groups of eight. Those 128 antennas will be spread out over an area of about 3km.


Building started on MWA radio telescope Electronics News

Australian Customs’ new weapons tracking system Electronics News

DATADOT’s assetDNA has been adopted by the Australian Customs and Border Protection Service as its Arms Inventory Management System.

assetDNA technology will provide realtime tracking of Customs and Border Protection’s 6000 weapons and personal defence equipment, which are dispersed among 37 land-based and 11 vessel armouries.

assetDNA is a technology for identifying, tracking and managing assets over their life cycles.

It arose from a joint venture between DataDot and Relegen, and the solution adopted by the Australian Customs and Border Protection Service combines Relegen’s software and multi-layer tags, utilising DDT’s DataTraceDNA and HID Global’s Logi Tag and IN Tag solutions.

The asset intelligence system provides the ability to connect thousands of real-world assets with corporate information and give Customs and Border Protection’s Central Office an accurate and real-time view.


Australian Customs' new weapons tracking system Electronics News

Electronex 2012: early bird stall booking now open Electronics News

EARLY booking of stalls is now available for Electronex 2012, following the success of the 2011 iteration in September.

Electronex 2012 will return to the Sydney location at the Australian Technology Park, but will be at a larger space, the Exhibition Hall. Catering will be available, and the SMCBA Conference rooms will be directly above the hall.

Organisers are now inviting all industry suppliers and companies wishing to exhibit to book at an early bird rate. New 2012 rates will come into effect from 1 January 2012.

Early bookings will also have a higher possibility of requested sites being available, since these will be allocated in the order of preference in which they are received.

According to Electronex organsiers, 62 percent of all Sydney and Melbourne exhibitors achieved results which were better or in excess of all previous shows attended, 37 percent of the stall holders in Sydney generated sales at the show, while 25 percent passed on leads.


Electronex 2012: early bird stall booking now open Electronics News

IBM’s 3D process for next generation memory devices Electronics News

MICRON will begin production of its Hybrid Memory Cube device using IBM’s advanced through-silicon via (TSV) process.

The Hybrid Memory Cube features a stack of individual chips connected by vertical pipelines or “vias”. These combine high-performance logic with Micron’s DRAM. It is hoped that the new device will deliver bandwidth and efficiencies a leap beyond current device capabilities.

HMC prototypes have clocked in with bandwidth of 128GB/s, in comparison with current state-of-the-art devices which deliver 12.8GB/s.

HMC also requires 70 percent less energy to transfer data while offering a small form factor — just 10 percent of the footprint of conventional memory.

IBM says its new 3D manufacturing technology is used to connect the 3D micro structure, and will be the foundation for commercial production of the new memory cube.

Hybrid Memory Cube parts will be manufactured at IBM's advanced semiconductor fab in East Fishkill, New York, using the company's 32nm, high-K metal gate process technology.

IBM says the 3D manufacturing process will have applications beyond memory. 3D chip technology is expected to make its way into consumer products in the next few years, drastically improving battery life and functionality.


IBM's 3D process for next generation memory devices Electronics News

2011-12-01

Plastic memory firm recruits organic ink startup


LONDON – Long-time plastic memory research company Thin Film Electronics ASA has announced a partnership with Polyera Corp. , a 2005 startup that supplies organic semiconductor, dielectric, and interfacial materials for the flexible and printed electronics industry.

The two companies have agreed to co-develop gravure-based ink formulations for use in high-throughput printing equipment and will prototype integrated printed system products incorporating Polyera materials, including n-type semiconductors, with Thinfilm Addressable Memory.

The agreement calls for Polyera (Skokie, Illinois) to supply commercial quantities for Thin Film (Olso, Norway) and partner manufacturers and to have exclusive rights to ink formulations developed for Thin Film's field of use.

"Polyera's groundbreaking work on n-type organic transistors has paved the way for printed CMOS circuits – more energy-efficient logic circuitry with simpler design. Such printed logic plays a key role when we now are combining our memory technology with other printed components to enable printed systems," said Davor Sutija, CEO of Thin Film Electronics.

Thin Film and PARC, the research arm of Xerox, used Polytera materials to demonstrate a printed non-volatile memory device addressed with complementary organic circuits, the organic equivalent of CMOS circuitry. The addition of integrated circuits makes the roll-to-roll printed Thinfilm Memory addressable by printable logic.

"We are building an ecosystem and supply chain for a world filled with the Internet of things, where everything is connected via a smart tag. By engaging with state-of-the-art partners like Polyera, Solvay, who provides the ferroelectric polymer memory material, and InkTec, who recently opened a facility dedicated to manufacturing Thinfilm Memory, we move significantly closer to our goal of enabling fully printed electronics and our memory everywhere vision," said Sutija.

Thin Film announced in August 2011 that InkTec Co. Ltd. (Ansan, South Korea) had opened a production facility dedicated to Thin Film's plastic memory. The manufacturing capacity of the facility was not disclosed.


Related links and articles:

www.thinfilm.se

www.polyera.com

News articles:


Thin Film, PARC tip printed 'CMOS' plastic memory

Thin Film offers passive plastic NVM

PARC invests in plastic memory hopeful

More details emerge on printed roll-to-roll memory


Plastic memory firm recruits organic ink startup

2011-11-30

Tegal invests in Israeli medtech startup

SAN FRANCISCO—Semiconductor equipment supplier Tegal Corp. said Tuesday (Nov. 29) it made a $300,000 strategic investment in NanoVibronix Inc., a privately held firm that develops medical devices and products that implement its proprietary therapeutic ultrasound technology.

NanoVibronix (Nesher, Israel) is a medical device company focused on creating products utilizing its proprietary low-intensity surface acoustic wave (SAW) technology, according to Tegal. The firm is developing a series of products aimed at the treatment of chronic, non-healing wounds, Tegal said.

The company's first product, PainShield MD has been cleared the U.S. Food and Drug Administration and achieved CE Mark certification in Europe, Tegal said. PainShield MD is marketed for the treatment of tendonitis, muscle pain and trigeminal neuralgia, Tegal said.

"Our investment in NanoVibronix expands the Tegal portfolio to new markets and new commercial horizons," said Thomas Mika, Tegal's president and CEO, in a statement.

Tegal invests in Israeli medtech startup